PART |
Description |
Maker |
MCZ33903CS5EK/R2 MCZ33903CS5EKR2 MCZ33903C3EK/R2 M |
SBC Gen2 with CAN High Speed and LIN Interface
|
Freescale Semiconductor, Inc
|
PCZ33905S3EK_R2 PCZ33904A3EK_R2 MCZ33904A5EK_R2 PC |
System Basis Chip Gen2 with High Speed CAN and LIN Interface
|
Freescale Semiconductor, Inc
|
MC33661 MC33661D MC33661R2 33661 |
LIN Enhanced Physical Interface
|
MOTOROLA[Motorola, Inc]
|
ZMD31030KIT ZMD31030AAF-R ZMD31030AAF-T |
Automotive Sensor Signal Conditioner with LIN Interface
|
Zentrum Mikroelektronik Dresden AG
|
USB-2-X |
USB to CAN,IIC,RS485,SPI,LIN Interface Converter
|
TRINAMIC Motion Control GmbH & Co. KG.
|
MM908E621ACDWB/R2 |
Integrated Quad Half-Bridge and Triple High-Side with Embedded MCU and LIN for High End Mirror
|
Freescale Semiconductor, Inc
|
MM908E622 MM908E622ACDR2 |
Integrated Quad Half-Bridge, Triple High-Side and EC Glass Driver with Embedded MCU and LIN for High End Mirror
|
飞思卡尔半导体(中国)有限公司
|
MM908E622ACDWB |
Integrated Quad Half-bridge, Triple High Side and EC Glass Driver with Embedded MCU and LIN for High End Mirror
|
Freescale Semiconductor, Inc
|
MC33910G5AC 3391010 |
LIN System Basis Chip with High
|
Freescale Semiconductor, Inc
|
L99PM62GXP |
Power Management IC with LIN and high speed CAN
|
ST Microelectronics
|
UJA1075 UJA1075TW_3V3 UJA1075TW_3V3_WD UJA1075TW_5 |
High-speed CAN/LIN core system basis chip
|
NXP Semiconductors N.V.
|
MC33910BAC MC33910BACR2 MC34910BAC MC34910BACR2 |
LIN System Basis Chip with 2x60mA High Side Drivers
|
Freescale Semiconductor, Inc
|