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  silicone Datasheet PDF File

For silicone Found Datasheets File :: 5554    Search Time::4.39ms    
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    NJSB036LT

NICHIA CORPORATION
Part No. NJSB036LT
OCR Text ...Material as follows ; Package : silicone Resin (with Diffused) Encapsulating Resin : Au Plating Electrodes : silicone Resin (with Diffused) Lens 4.PACKAGING * The LEDs are packed in cardboard boxes after taping. Please refer to "TAPING ...
Description TYPE BLUE LED

File Size 580.94K  /  16 Page

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    MPX2200 MPX2200A MPX2200AP MPX2200AS MPX2200D MPX2200DP MPX2200GP MPX2200GS MPX2200GVP MPX2200GVS MPX2201DP MPX2201GP MP

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX2200 MPX2200A MPX2200AP MPX2200AS MPX2200D MPX2200DP MPX2200GP MPX2200GS MPX2200GVP MPX2200GVS MPX2201DP MPX2201GP MPX2201
OCR Text ...versus Pressure Differential silicone GEL DIE COAT WIRE BOND WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates an absolute s...
Description 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕29 PSI)的全尺寸为40 mV跨度(典型)
0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕9 PSI)的全尺寸为40 mV跨度(典型)
(MPX2200 / MPX2201) 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL)

File Size 169.29K  /  8 Page

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    NFSW072T

NICHIA CORPORATION
Part No. NFSW072T
OCR Text ...ND MATERIALS : : : Ceramics silicone Resin (with Diffused + Phosphor) Au Plating Please refer to figure's page. Material as follows ; Package Encapsulating Resin Electrodes 4.PACKAGING * The LEDs are packed in cardboard boxes aft...
Description TYPE WHITE LED

File Size 312.71K  /  14 Page

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    NESW064AT

NICHIA CORPORATION
Part No. NESW064AT
OCR Text ...trodes : Heat-Resistant Polymer silicone Resin (with Diffused + Phosphor) Ag Plating Copper Alloy 4.PACKAGING * The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit sh...
Description TYPE WHITE LED

File Size 299.81K  /  13 Page

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    MPX2700A MPX2700AP MPX2700ASX

MOTOROLA INC
Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX2700A MPX2700AP MPX2700ASX
OCR Text ... in the chip carrier package. A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. MPX2700A series pressure sensor operating character...
Description ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 1%, 0-40mV, ROUND, THROUGH HOLE MOUNT
X-ducer SILICON PRESSURE SENSORS

File Size 164.50K  /  6 Page

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    MPX2700 MPX2700D MPX2700DP MPX2700GP MPX2700GS MPX2700GSX MPX2700GVP MPX2700GVS MPX2700GVSX

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX2700 MPX2700D MPX2700DP MPX2700GP MPX2700GS MPX2700GSX MPX2700GVP MPX2700GVS MPX2700GVSX
OCR Text ... TA = 25C P1 > P2 MAX TYP silicone DIE COAT SPAN RANGE (TYP) WIRE BOND DIE P1 STAINLESS STEEL METAL COVER PSI kPa 20 140 40 280 60 420 80 560 100 700 Figure 3. Output versus Pressure Differential Figure 4...
Description 0 to 700 kPa (0 to 100 psi) 40 mV FULL SCALE SPAN (TYPICAL) GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 0.5%, 0-40mV, ROUND, THROUGH HOLE MOUNT

File Size 187.83K  /  10 Page

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    MPX2200 MPX2200A MPX2200AP MPX2200D MPX2200DP MPX2200GP MPX220008

Freescale Semiconductor, Inc
Part No. MPX2200 MPX2200A MPX2200AP MPX2200D MPX2200DP MPX2200GP MPX220008
OCR Text ...r Operating Characteristics. silicone Gel Die Coat Wire Bond Differential/Gauge Die P1 Stainless Steel Metal Cover Epoxy Case silicone Gel Die Coat Wire Bond Absolute Die P1 Stainless Steel Metal Cover Epoxy Case Lead F...
Description 200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors

File Size 110.42K  /  8 Page

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    MPX2010 MPX201008 MPXM2010D MPXM2010DT1 MPXM2010GS MPXM2010GST1 MPXV2010DP MPXV2010GP MPX2010D MPX2010DP MPX2010GS MPX20

Freescale Semiconductor, Inc
Part No. MPX2010 MPX201008 MPXM2010D MPXM2010DT1 MPXM2010GS MPXM2010GST1 MPXV2010DP MPXV2010GP MPX2010D MPX2010DP MPX2010GS MPX2010GSX MPX2010GP
OCR Text ...asic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2010 series pressure sensor operating character...
Description 10 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors

File Size 345.52K  /  17 Page

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    MPX10 MPX1008 MPX10GP MPX10D MPX10DP MPXV10GC7U MPXV10GC6U

Freescale Semiconductor, Inc
Freescale Semiconductor...
Part No. MPX10 MPX1008 MPX10GP MPX10D MPX10DP MPXV10GC7U MPXV10GC6U
OCR Text ...asic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX10 series pressure sensor operating characteris...
Description 10 kPa Uncompensated Silicon Pressure Sensors

File Size 123.41K  /  9 Page

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    MBWW-KSG-7T6U-1 MBWW-KSG-17

DOMINANT Semiconductors
Part No. MBWW-KSG-7T6U-1 MBWW-KSG-17
OCR Text ...perature resistant plastic, ppa silicone resin ag plating dominant opto technologies innovating illumination tm note: this product is pb free 14/06/2016 v3.0 8 primaxplus ? 180 ingan white: mbww-kzhg package outlines material material le...
Description PrimaxPlus

File Size 1,372.81K  /  15 Page

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