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Toshiba Electronic Devices & Storage Corporation |
Part No. |
TPH1100CQ5
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Description |
N-ch MOSFET, 150 V, 49 A, 0.0111 Ω@10 V, High-speed diode, SOP Advance(N)
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Tech specs |
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Official Product Page
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Lite-On Technology, Corp. Agilent (Hewlett-Packard)
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Part No. |
HSDL-7001 HSDL-7001100
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Description |
IR 3/16 Encode/ Decode IC with 16X Clock SPECIALTY TELECOM CIRCUIT, PDSO16 HSDL-7001 · IR 3/16 Encode/ Decode IC with 16X Clock Generator
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File Size |
142.45K /
8 Page |
View
it Online |
Download Datasheet
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Rochester Electronics LLC |
Part No. |
54ACT11004FK/B
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Description |
54ACT11004 - HEX INVERTER, TTL-COMPATIBLE INPUTS
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
20021111-00016T4LF
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Description |
Minitek127®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 1.27mm (0.050in) pitch.
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Tech specs |
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Official Product Page
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Ecliptek, Corp.
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Part No. |
HSDL-1100008 HSDL-1100018 HSDL-1100007 HSDL-1100017
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Description |
IrDA 1.1 Compliant 4Mb/s 5V Transceiver. Top Option.Tape & ReelLINot Recommended for New Designs) IrDA 1.1Compliant 4Mb/s 5V Transceiver. Top Opt. 10 units/stripLINot Recommended for New Designs) IrDA 1.1Compliant 4Mb/s 5V Transceiver.Front Option.Tape & Reel<LINot Recommended for New Designs) 红外1.1Compliant 4Mb sV的Transceiver.Front Option.Tape IrDA 1.1Compliant 4Mb/s 5V Transceiver.Front Opt.10 units/strip<LINot Recommended for New Designs) 红外1.1Compliant 4Mb sV的Transceiver.Front Opt.10单位/条\u0026lt;LI\u0026gt;(不推荐用于新设计)
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File Size |
237.22K /
12 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
20021511-00012T4LF
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Description |
1.27mm (0.05in.) pitch, Shrouded header, 12 contacts
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-107401100LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-115401100LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
20021611-00040T4LF
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Description |
1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
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Tech specs |
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Official Product Page
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Avago Technologies Ltd.
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Part No. |
HSDL-3002
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Description |
IrDAData Compliant Low Power 115.2 kbit/s with Remote Control Transmission Infrared Transceiver
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File Size |
440.70K /
20 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
20021211-00080T1LF
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Description |
Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 80 Positions, 1.27 mm (.050in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
20021211-000A0T4LF
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Description |
Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
20021611-00006T8LF
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Description |
1.27mm (0.05in.) pitch, Header with eject latch, 6 contacts
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Tech specs |
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Official Product Page
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Part: HSDL-1100 |
Maker: AGILENT |
Pack: N/A |
Stock: 1266 |
Unit price
for : |
50: $2.40 |
100: $2.28 |
1000:
$2.16 |
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