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Amphenol Communications Solutions |
Part No. |
10125112-080012CLF
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Description |
HPCE BTB R/A Receptacle 8P12S WITH GUIDE
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Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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Part No. |
BT139-800127
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Description |
Triacs - I<sub>GT</sub>: 35 mA; I<sub>T</sub> (R<sub>MS</sub>): 16 A; V<sub>DRM</sub>: 800 V; Package: SOT78 (TO-220AB); Container: Tube pack 800 V, 16 A, 4 QUADRANT LOGIC LEVEL TRIAC, TO-220AB
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File Size |
175.33K /
14 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10125023-080012ALF
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Description |
HPCE BTB VT RECEPT 8P12S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-205HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-226HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 26 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10121506-080012CLF
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Description |
HPCE STD VT Receptacle 8P12S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-225HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 25 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-232HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 32 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10122237-480012ALF
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Description |
HPCE-STD STRADDLE MOUNT 48P12S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68001-200HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 1 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0123 0015800123
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat Molex Electronics Ltd.
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File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68001-204
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 4 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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