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Filtronic Compound Semi... FILTRONIC[Filtronic Compound Semiconductors]
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Part No. |
FMA219
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OCR Text |
...h
150pF capacitor To +VDD
75m nominal gap on each side 250m Au ribbon recommended
Notes: * Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram.... |
Description |
X-BAND LNA MMIC
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File Size |
325.92K /
5 Page |
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75m-diameter Found Datasheets File :: 28 Search Time::1.25ms Page :: | <1> | 2 | 3 | |
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