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  75757-6181 Datasheet PDF File

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    0757576181 75757-6181

Molex Electronics Ltd.
http://
Part No. 0757576181 75757-6181
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137926-1811LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 18 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-5121

Molex Electronics Ltd.
Part No. 75757-5121
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7618-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-0431

Molex Electronics Ltd.
Part No. 75757-0431
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 99.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6618-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    75757-0432

Molex Electronics Ltd.
Part No. 75757-0432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 99.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 10156618-1600LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 16 positons
Tech specs    

Official Product Page

    75757-1421

Molex Electronics Ltd.
Part No. 75757-1421
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.5um (60u) Tin (Sn) Plating

File Size 166.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127716-181LF
Description Minitek® Pwr 3.0, Dual Row, Receptacle Housing, 18 Positions, Non GW Compatible Nylon66, Natural Color.
Tech specs    

Official Product Page

    75757-1432

Molex Electronics Ltd.
Part No. 75757-1432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137926-1813LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Natural Color, 18 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

    75757-1441

Molex Electronics Ltd.
Part No. 75757-1441
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 1.5μm (60μ)Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.43K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE3A1886181
Description Modular Jack - 8P8C, RA, Cat5e, SMT, single Port, Shield With No EMI Tabs, With LEDs , Flash
Tech specs    

Official Product Page

    75757-1302

Molex Electronics Ltd.
Part No. 75757-1302
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length

File Size 166.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3618-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-5261

Molex Electronics Ltd.
Part No. 75757-5261
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8618-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-1221

Molex Electronics Ltd.
Part No. 75757-1221
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7618-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For 75757-6181 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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