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  68000 Datasheet PDF File

For 68000 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Q68000-A8787 CGY62

SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
Part No. Q68000-A8787 CGY62
Description GaAs MMIC (Two-stage microwave broadband amplifier IC 50 input / output) 200 MHz - 1800 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
GaAs MMIC (Two-stage microwave broadband amplifier IC 50 input / output)
From old datasheet system
GaAs MMIC (Two-stage microwave broadband amplifier IC 50 ヘ input / output)

File Size 25.79K  /  5 Page

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Amphenol Communications Solutions

Part No. 68000-705HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 5 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    BAV70 Q68000-A6622

SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. BAV70 Q68000-A6622
Description Silicon Switching Diode Array (For high-speed switchingFor high-speed switching) 0.2 A, 2 ELEMENT, SILICON, SIGNAL DIODE

File Size 97.81K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-112HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. CGY59 Q68000-A8887
Description GaAs MMIC (Low noise preamplifier for mobile communication PCN DECT GSM in 2.7V to 6V systems)
From old datasheet system
GaAs MMIC (Low noise preamplifier for mobile communication PCN, DECT, GSM in 2.7V to 6V systems)

File Size 48.45K  /  8 Page

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Amphenol Communications Solutions

Part No. 68000-219HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    Q68000-A8615 CGY52

SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. Q68000-A8615 CGY52
Description GaAs MMIC (Two stages monolithic microwave IC MMICAmplifier All gold metallisation) 砷化镓微波单片集成电路(两个阶段单片微波IC MMICAmplifier所有黄金metallisation
From old datasheet system

File Size 36.53K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-109HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. Q68000-A6887 CGY31
Description GaAs MMIC (Two-stage monolithic microwave IC MMIC amplifier All-gold metallization Chip fully passivated)
From old datasheet system

File Size 137.77K  /  9 Page

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Amphenol Communications Solutions

Part No. 68000-426HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    2N3019 Q68000-A627

SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. 2N3019 Q68000-A627
Description NPN SILICON PLANAR TRANSISTOR

File Size 135.81K  /  5 Page

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Amphenol Communications Solutions

Part No. 68000-606H
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
Part No. Q68000-A8000 IRL81 IRL81A
Description From old datasheet system
GaAlAs-Infrarot-Sendediode GaAlAs Infrared Emitter
ECONOLINE: RB & RA - Dual Output from a Single Input Rail- Power Sharing on Output- Industry Standard Pinout- 1kVDC & 2kVDC Isolation- Custom Solutions Available- UL94V-0 Package Material- Efficiency to 85% 发动 Infrarot - Sendediode GaAlA红外发射

File Size 151.84K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-116HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    68300 64400 68000 68200

Cooper Bussmann, Inc.
Part No. 68300 64400 68000 68200
Description Fuse
   Welder Limiters Class H and J Fuseholders

File Size 37.75K  /  1 Page

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Amphenol Communications Solutions

Part No. 68000-117
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 17 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. Q68000-A7851 IRL80A IRL80
Description GaAs-Infrarot-Sendediode GaAs Infrared Emitter
From old datasheet system

File Size 122.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-226HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    LPT80 LPT80A Q68000-A7852

SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. LPT80 LPT80A Q68000-A7852
Description CAP CER DISC 82PF 3KV SL 5% RAD
NPN-Silizium-Fototransistor Silicon NPN Phototransistor
From old datasheet system

File Size 35.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-126HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For 68000 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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