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    0015800083-17

Molex Electronics Ltd.
Part No. 0015800083-17
Description 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

File Size 24.47K  /  2 Page

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Samtec Inc

Part No. TCSD-10-D-15.80-01-F-N
Description Cable Assembly,
Tech specs    

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Official Product Page

HUA FENG CIRCUIT





    0015800561

Molex Electronics Ltd.
Part No. 0015800561
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, Tin (Sn) Plating

File Size 1,218.23K  /  7 Page

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Samtec Inc

Part No. FFSD-05-S-15.80-01-N
Description Board Connector, 10 Contact(s), 2 Row(s), Female, IDC Terminal
Tech specs    

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Official Product Page

    0015800563

Molex Electronics Ltd.
Part No. 0015800563
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits

File Size 1,218.25K  /  7 Page

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Samtec Inc

Part No. TCSD-05-D-15.80-01-N
Description Interconnection Device, ROHS COMPLIANT
Tech specs    

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Official Product Page

    0015800243

Molex Electronics Ltd.
Part No. 0015800243
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits

File Size 1,218.29K  /  7 Page

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Samtec Inc

Part No. FFSD-10-D-15.80-01-N
Description Interconnection Device
Tech specs    

Get Free Sample

Official Product Page

    0015800245

Molex Electronics Ltd.
Part No. 0015800245
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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Samtec Inc

Part No. TCSD-08-D-15.80-01-F-N
Description Interconnection Device, ROHS COMPLIANT
Tech specs    

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Official Product Page

    0015800263

Molex Electronics Ltd.
Part No. 0015800263
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Samtec Inc

Part No. FFSD-13-D-15.80-01-N-RW
Description Interconnection Device
Tech specs    

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Official Product Page

    15-80-0621 0015800621

Molex Electronics Ltd.
Part No. 15-80-0621 0015800621
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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Samtec Inc

Part No. TCSD-10-D-15.80-01-N
Description Interconnection Device, ROHS COMPLIANT
Tech specs    

Get Free Sample

Official Product Page

    0015800343

Molex Electronics Ltd.
Part No. 0015800343
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

File Size 1,218.29K  /  7 Page

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Samtec Inc

Part No. TCSD-05-D-15.80-01-F-N
Description Interconnection Device, ROHS COMPLIANT
Tech specs    

Get Free Sample

Official Product Page

    15-80-0403 0015800403

Molex Electronics Ltd.
Part No. 15-80-0403 0015800403
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits

File Size 1,218.28K  /  7 Page

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Samtec Inc

Part No. MTMM-105-05-F-S-158-002
Description Board Stacking Connector, 5 Contact(s), 1 Row(s), Male, Straight, Solder Terminal,
Tech specs    

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Official Product Page

    0015800725

Molex Electronics Ltd.
Part No. 0015800725
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.15K  /  7 Page

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Samtec Inc

Part No. FFMD-10-T-15.80-01-N
Description Interconnection Device, LEAD FREE
Tech specs    

Get Free Sample

Official Product Page

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