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  00158 Datasheet PDF File

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    0015800665

Molex Electronics Ltd.
Part No. 0015800665
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Microchip Technology Inc

Part No. SY100158JCTR
Description SY100158JCTR
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    15-80-0605 0015800605

Molex Electronics Ltd.
Part No. 15-80-0605 0015800605
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Microchip Technology Inc

Part No. SY100158JC
Description SY100158JC
Tech specs    

Official Product Page

    0015800663

Molex Electronics Ltd.
Part No. 0015800663
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    0015800369 15-80-0369

Molex Electronics Ltd.
Part No. 0015800369 15-80-0369
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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    15-80-0701 0015800701

Molex Electronics Ltd.
Part No. 15-80-0701 0015800701
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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    15-80-0705 0015800705

Molex Electronics Ltd.
Part No. 15-80-0705 0015800705
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    0015800425

Molex Electronics Ltd.
Part No. 0015800425
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    0015800721

Molex Electronics Ltd.
Part No. 0015800721
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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    0015800265

Molex Electronics Ltd.
Part No. 0015800265
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    15-80-0401 0015800401

Molex Electronics Ltd.
Part No. 15-80-0401 0015800401
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.27K  /  7 Page

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