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00102 FEP16 EPB5154G 00010 TN9113 2SA1194 VTP5050 400SJ
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  0015477 Datasheet PDF File

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    0015477618

Molex Electronics Ltd.
Part No. 0015477618
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.39K  /  4 Page

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HUA FENG CIRCUIT





    0015477616

Molex Electronics Ltd.
Part No. 0015477616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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    0015477614

Molex Electronics Ltd.
Part No. 0015477614
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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    0015477612

Molex Electronics Ltd.
Part No. 0015477612
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 377.39K  /  4 Page

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    0015477606

Molex Electronics Ltd.
Part No. 0015477606
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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    0015477562 15-47-7562

Molex Electronics Ltd.
Part No. 0015477562 15-47-7562
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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    0015477560 15-47-7560

Molex Electronics Ltd.
Part No. 0015477560 15-47-7560
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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    0015477548 15-47-7548

Molex Electronics Ltd.
Part No. 0015477548 15-47-7548
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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    0015477638 15-47-7638

Molex Electronics Ltd.
Part No. 0015477638 15-47-7638
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin

File Size 377.46K  /  4 Page

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    0015477636 15-47-7636

Molex Electronics Ltd.
Part No. 0015477636 15-47-7636
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin

File Size 377.46K  /  4 Page

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