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AGILENT TECHNOLOGIES INC
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| Part No. |
AMMC-3040-W10 AMMC-3040-W50
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| OCR Text |
...ore require only a single bond wire. a separate bond wire is needed for the first stage dc drain bias, v d1. the third and fourth stage dc gate bias lines are connected internally. a total of three dc gate bond wires are required: on... |
| Description |
18000 MHz - 36000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX
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| File Size |
99.01K /
6 Page |
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RF MICRO DEVICES INC
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| Part No. |
SDA-5000SB
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| OCR Text |
... supply rf & dc bonds 1mil gold wire x=2200 y=1450 1 rfin 2 vg2 1000pf 3 1000pf 4 rfout vdd note note: drain bias (vdd) must be applied th...bond wire loop height was 100 m. the thickness of the test interface is 125 m (5mil). the calibra... |
| Description |
0 MHz - 35000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
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| File Size |
557.80K /
8 Page |
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it Online |
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MINI-SYSTEMS INC
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| Part No. |
MSAT-21G-10.5DB
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| OCR Text |
... 99.6% alumina 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderabl... |
| Description |
0 MHz - 20000 MHz RF/MICROWAVE VARIABLE ATTENUATOR
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| File Size |
37.96K /
1 Page |
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it Online |
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MOTOROLA INC
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| Part No. |
MPX2101GP
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| OCR Text |
...2 max silicone gel die coat wire bond lead frame differential/gauge die stainless steel metal cover epoxy case differential/gauge element die bond silicone gel die coat wire bond lead frame absolute die stainless steel metal cover e... |
| Description |
GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-14.5Psi, ROUND, THROUGH HOLE MOUNT
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| File Size |
193.89K /
8 Page |
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it Online |
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MOTOROLA INC
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| Part No. |
MPX2100A
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| OCR Text |
...2 max silicone gel die coat wire bond lead frame differential/gauge die stainless steel metal cover epoxy case differential/gauge element die bond silicone gel die coat wire bond lead frame absolute die stainless steel metal cover e... |
| Description |
ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 0-14.5Psi, 1%, 0-40mV, ROUND, THROUGH HOLE MOUNT
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| File Size |
61.52K /
4 Page |
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it Online |
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MIMIX BROADBAND INC
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| Part No. |
CMM-2-BD-000X
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| OCR Text |
... are critical during placement. wire bonding - windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. the recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x... |
| Description |
2000 MHz - 10000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
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| File Size |
463.19K /
5 Page |
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it Online |
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