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  TES1-0513 Datasheet PDF File

For TES1-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    51353-2000 0513532000

Molex Electronics Ltd.
Part No. 51353-2000 0513532000
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Dual Row, 20 circuits

File Size 242.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 68405-138HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    51336-1710 0513361710

Molex Electronics Ltd.
Part No. 51336-1710 0513361710
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 17Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 17Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 68405-132HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    51336-1510 0513361510

Molex Electronics Ltd.
Part No. 51336-1510 0513361510
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 15Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 15Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 68405-134HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    51336-1210 0513361210

Molex Electronics Ltd.
Part No. 51336-1210 0513361210
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 12Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 12Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 68705-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51336-0410 0513360410

Molex Electronics Ltd.
Part No. 51336-0410 0513360410
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 4Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 4Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 4Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51336-1110 0513361110

Molex Electronics Ltd.
Part No. 51336-1110 0513361110
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 11Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 11Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 11Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 10120513-002C-TRLF
Description SAS/PCIe 3.0 (U.2) Connectors, Storage and Server Connector, 68 Position Vertical Recep SMT, 12Gb/s.
Tech specs    

Official Product Page

    51336-1010 0513361010

Molex Electronics Ltd.
Part No. 51336-1010 0513361010
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 10 Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 10 Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 54102-S0513B03LF
Description BERGSTIK 0.100\\ HEADER-REPLACMNT 77313-801-26LF
Tech specs    

Official Product Page

    0513460800 51346-0800

Molex Electronics Ltd.
Part No. 0513460800 51346-0800
Description 3.30mm (.130") Pitch Wire-to-Wire Plug Housing, Positive Lock, Dual Row, 8 Circuits
3.30mm (.130) Pitch Wire-to-Wire Plug Housing, Positive Lock, Dual Row, 8 Circuits

File Size 243.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 98426-S04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51336-0910 0513360910

Molex Electronics Ltd.
Part No. 51336-0910 0513360910
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 9Circuits

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 10130513-201LF
Description Metral® High Speed 4000 Series, Backplane Connector, Receptacle, Right Angle, 5 Row, Press-Fit, 30 Position
Tech specs    

Official Product Page

    51336-0810 0513360810

Molex Electronics Ltd.
Part No. 51336-0810 0513360810
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 8Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 8Circuits

File Size 99.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 68705-132HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For TES1-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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