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Murata Manufacturing Co...
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| Part No. |
GRM31M3U1H104JA01
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| OCR Text |
...opper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive strength of termination,... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
618.46K /
30 Page |
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it Online |
Download Datasheet
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Murata Manufacturing Co...
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| Part No. |
GRM31M2C2A563JA01
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| OCR Text |
...opper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive strength of termination,... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
635.65K /
30 Page |
View
it Online |
Download Datasheet
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motorola
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| Part No. |
MT48LC16M16A2
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| OCR Text |
...ly used dielectric material for pcbs is FR-4, a glass laminate with epoxy resin that meets a wide variety of processing conditions. The r for FR-4 is between 4.1 and 4.5. GETEK is another material that can be used in high speed boards. GETE... |
| Description |
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| File Size |
465.22K /
24 Page |
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it Online |
Download Datasheet
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Murata Manufacturing Co...
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| Part No. |
GRM31M2C2A473JA01
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| OCR Text |
...opper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive strength of termination,... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
618.38K /
30 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Murata Manufacturing Co...
|
| Part No. |
GRM31M2C1H563JA01
|
| OCR Text |
...opper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive strength of termination,... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
617.62K /
30 Page |
View
it Online |
Download Datasheet
|
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|
 |
Murata Manufacturing Co...
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| Part No. |
GRM0335C2AR90WA01
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| OCR Text |
...opper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive strength of termination,... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
619.27K /
30 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Murata Manufacturing Co...
|
| Part No. |
GRM31M2C1H473JA01
|
| OCR Text |
...opper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive strength of termination,... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
618.59K /
30 Page |
View
it Online |
Download Datasheet
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|
 |
Murata Manufacturing Co...
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| Part No. |
GRM1885C1H132JA01
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| OCR Text |
...opper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive strength of termination,... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
615.66K /
30 Page |
View
it Online |
Download Datasheet
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|
 |
Murata Manufacturing Co...
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| Part No. |
GRM1885C1H112JA01
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| OCR Text |
...opper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive strength of termination,... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
615.52K /
30 Page |
View
it Online |
Download Datasheet
|
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