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				ST Microelectronics STMicroelectronics
Part No.	HSP061-2M6 HSP061-2N4 HSP061-2P6 HSP061-2
OCR Text	... solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side ...air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temper...
Description	2-line ESD protection for high speed lines
File Size	246.62K / 12 Page	View it Online	Download Datasheet

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