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For fragile Found Datasheets File :: 528 Search Time::2.328ms
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				Hittite Microwave Corporation
Part No.	HMC565
OCR Text	...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. 0.127mm (0.005") Thick Alumina Thin Film Substrate Figure 1. 0.102mm (0.004") Thick GaAs MMIC Wire Bond 0.076mm (...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 6 - 20 GHz
File Size	283.34K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC566 HMC565
OCR Text	...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. 0.127mm (0.005") Thick Alumina Thin Film Substrate Figure 1. 0.102mm (0.004") Thick GaAs MMIC Wire Bond 0.076mm (...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 29 - 36 GHz GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 6 - 20 GHz
File Size	287.26K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo... Hittite Microwave Corporation 美国讯泰微波有限公司上海代表
Part No.	HMC322
OCR Text	...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface...
Description	GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 10.0 GHz GaAs MMIC SP8T NON-REFLECTIVE SWITCH/ DC - 10.0 GHz
File Size	175.07K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC329
OCR Text	...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct...
Description	GaAs MMIC DOUBLE-BALANCED MIXER/ 25 - 40 GHz GaAs MMIC DOUBLE-BALANCED MIXER, 25 - 40 GHz
File Size	163.05K / 6 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMA3007
OCR Text	...INSTRUCTIONS: GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature s...
Description	2-20GHZ BROADBAND MMIC AMPLIFIER
File Size	142.01K / 6 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	FMS2028-000-FF FMS2028-000-WP FMS2028 FMS2028-000-EB
OCR Text	...INSTRUCTIONS: GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is not metallised and the recommended mounting method is by the use of conductive e...
Description	SP6T GaAs Multi-Band GSM Antenna Switch
File Size	242.07K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC392
OCR Text	...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct...
Description	GaAs MMIC LOW NOISE AMPLIFIER, 3.5 - 7.0 GHz
File Size	225.43K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC395
OCR Text	...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 4.0 GHz
File Size	197.46K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC396
OCR Text	...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 8.0 GHz
File Size	212.33K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC397
OCR Text	...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 10.0 GHz
File Size	211.61K / 6 Page	View it Online	Download Datasheet

For fragile Found Datasheets File :: 528 Search Time::2.328ms
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