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21308 01300 0240NH R6200440 TA940 MC44036 APTGT100 HV5622
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    HMC559

Hittite Microwave Corporation
Part No. HMC559
OCR Text ...lication circuit herein. Please follow "MMIC Amplifier Biasing Procedure" application note. 5 Vgg1 6 ACG1 Low frequency termination. Attach bypass capacitor per application circuit herein. Die Bottom GND Die bottom m...
Description GaAs PHEMT MMIC POWER AMPLIFIER, DC - 20.0 GHz

File Size 374.39K  /  8 Page

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    HMC560LM3

Hittite Microwave Corporation
Part No. HMC560LM3
OCR Text ...ales & Application Engineering. follow these precautions to avoid permanent damage: 225 200 TEMPERATURE ( C) 175 150 0 7 MIXERS - SMT 7 - 425 125 100 75 50 25 Cleanliness: Observe proper handling procedures to ensure clean 0 ...
Description GaAs MMIC FUNDAMENTAL SMT MIXER, 24 - 40 GHz

File Size 322.45K  /  8 Page

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    HMC634

Hittite Microwave Corporation
Part No. HMC634
OCR Text ... control for amplifi er, please follow mmic ampli- fi er biasing procedure application note. see assembly diagram for required external components. die bottom gnd die bottom must be connected to rf/dc ground. hmc634 v01.0308 gaas phemt mmi...
Description GaAs PHEMT MMIC DRIVER AMPLIFIER, 5 - 20 GHz

File Size 288.86K  /  8 Page

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    HMC562

Hittite Microwave Corporation
Part No. HMC562
OCR Text ...capacitors are required. Please follow "MMIC Amplifer Biasing Procedure" application note. 5 Vgg Die Bottom GND Die bottom must be connected to RF/DC ground. For price, delivery, and to place orders, please contact Hittite...
Description GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER, 2 - 35 GHz

File Size 331.54K  /  8 Page

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    7720-1-EVM 7720-2A 7720-1A 7720-3A 7700-2A

Bi technologies
Part No. 7720-1-EVM 7720-2A 7720-1A 7720-3A 7700-2A
OCR Text ...o is force the input current to follow the input line voltage regardless of what the load current (the switching power supply) is doing. if the input current is sinusoidal then the harmonic and peak current problems are solved, and if the ...
Description PFC DESIGN TIPS & TECHNIQUES

File Size 232.61K  /  6 Page

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    HMC268LM1

Hittite Microwave Corporation
Part No. HMC268LM1
OCR Text ... 100 1 AMPLIFIERS SMT 75 follow these precautions to avoid permanent damage: Cleanliness: Observe proper handling procedures to ensure 50 clean devices and PCBs. LM1 devices should remain in their 25 original packaging until componen...
Description SMT LOW NOISE AMPLIFIER MMIC 20 - 32 GHz

File Size 168.77K  /  8 Page

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    GP800FSM18

Dynex Semiconductor Ltd.
DYNEX[Dynex Semiconductor]
Part No. GP800FSM18
OCR Text ...ostatic discharge. Users should follow ESD handling procedures. 1/10 www.dynexsemi.com GP800FSM18 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. I...
Description Hi-Reliability Single Switch IGBT Module

File Size 143.30K  /  10 Page

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    GP800FSS12

DYNEX[Dynex Semiconductor]
Part No. GP800FSS12
OCR Text ...ostatic discharge. Users should follow ESD handling procedures. 1/11 GP800FSS12 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as w...
Description Powerline N-Channel Single Switch IGBT Module Preliminary Information

File Size 88.65K  /  11 Page

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