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  bonded-pair Datasheet PDF File

For bonded-pair Found Datasheets File :: 314    Search Time::2.157ms    
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    GENNUM[Gennum Corporation]
Part No. GS9078ACNE3 GS9078A
OCR Text ...ntrol resistor. No Connect. Not bonded internally. Most positive power supply connection. Connect to +3.3V. Serial digital differential output. Connect to most negative power supply plane following the recommendations in Recommended PCB Foo...
Description GS9078A HD-LINX-R II Multi-Rate Cable Driver

File Size 243.42K  /  14 Page

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    Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
美国讯泰微波有限公司上海代表
Part No. HMC362
OCR Text ...wer output, this port should be bonded to ground. For low power output, this port should be floating. Handling Precautions Follow these ...pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched wit...
Description GaAs HBT MMIC DIVIDE-BY-4, DC - 11.0 GHz
600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN

File Size 184.38K  /  6 Page

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    HOLTEK[Holtek Semiconductor Inc]
Part No. HTG1390 1390
OCR Text ...9 935.39 These pins must be bonded out for functional testing. 4 17th Nov '98 Preliminary Pad Description Pad No. 17, 18 8 9...pair R1,R0. However as R1,R0 can only store 8 bits, these instructions cannot fully specify the full...
Description From old datasheet system
4-bit Microcontroller

File Size 423.31K  /  27 Page

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    MACOM[Tyco Electronics]
Part No. MASW4060G
OCR Text ... connected to each RFx port. If bonded to ground, it will cause the related port to be absorbative, or matched, in the isolated condition. A...pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers. 1.5 1.0 ...
Description GaAs SP4T Switch DC - 4.0 GHz

File Size 59.68K  /  3 Page

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    IXYS, Corp.
IXYS[IXYS Corporation]
Part No. MCC122-18IO1 MCC122 MCC122-08IO1 MCC122-12IO1 MCC122-14IO1 MCC122-16IO1
OCR Text ...tandard package * Direct copper bonded Al2O3-ceramic base plate * Planar passivated chips * Isolation voltage 3600 V~ * UL registered, E 728...pair 4/5) UL Styles 1385, Type ZY 180R (R = right for pin pair 6/7) CSA Class 5851, File 41234 (c...
Description Thyristor Module 300 A, 800 V, SCR
From old datasheet system
Thyristor and Rectifiers Modules

File Size 43.47K  /  2 Page

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    IXYS[IXYS Corporation]
Part No. MCD161-22IO1 MCC161 MCC161-20IO1 MCC161-22IO1 MCD161-20IO1
OCR Text ...tandard package * Direct Copper Bonded Al2O3-ceramic base plate * Planar passivated chips * Isolation voltage 3600 V~ * UL registered, E 728...pair 4/5) UL 758, style 1385, Type ZY 180R (R = right for pin pair 6/7) CSA class 5851, guide 460-1-...
Description High Voltage Thyristor Module

File Size 87.63K  /  3 Page

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    IXYS[IXYS Corporation]
Part No. MCD94-22IO1B MCC94 MCC94-20IO1B MCC94-22IO1B MCD94-20IO1B
OCR Text ..., JEDEC TO-240 AA Direct Copper Bonded Al2O3 -ceramic base plate Planar passivated chips Isolation voltage 3600 V~ UL registered, E 72873 Ga...pair 4/5) UL 758, style 1385, Type ZY 200R (R = right for pin pair 6/7) CSA class 5851, guide 460-1-...
Description Thyristor and Rectifiers Modules
High Voltage Thyristor Module High Voltage Thyristor/Diode Modules

File Size 51.98K  /  2 Page

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    IXYS[IXYS Corporation]
Part No. MCO450-22IO1 MCO450 MCO450-20IO1
OCR Text ... q q q q q Direct copper bonded Al2O3 -ceramic with copper base plate Planar passivated chips Isolation voltage 3600 V~ UL applied Ke...pair 4/5) CSA class 5851, guide 460-1-1, appl. 41234 10 1 0.01 0.1 1 IG A 10 Dimensions in ...
Description High Power Single Thyristor Module

File Size 64.85K  /  4 Page

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    IXYS[IXYS Corporation]
Part No. MCO500-18IO1 MCO500 MCO500-12IO1 MCO500-14IO1 MCO500-16IO1
OCR Text ... standard package Direct copper bonded Al2O3-ceramic with copper base plate Planar passivated chips Isolation voltage 3600 V~ UL registered ...pair 4/5) CSA class 5851, guide 460-1-1 10 1 Dimensions in mm (1 mm = 0.0394") 0.01 0...
Description 1800V high power thyristor module
1600V high power thyristor module
1400V high power thyristor module
1200V high power thyristor module
High Power Thyristor Modules

File Size 59.19K  /  4 Page

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    Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
Mosel Vitelic, Corp.
Part No. MSS0271
OCR Text .... IN0 and IN1 They should be bonded to ground both regularly. While abnormal lot (pitch shifted) is encountered, special bonding could be...pair SP+ and SP-. Due to a sophisticated architecture, there demands no ramp up (or ramp down) to el...
Description 2.7 VOICE ROM
Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection

File Size 60.19K  /  12 Page

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For bonded-pair Found Datasheets File :: 314    Search Time::2.157ms    
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