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  90814-0918 Datasheet PDF File

For 90814-0918 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    91814-3106 SD-91814-001 0918143106

Molex Electronics Ltd.
Part No. 91814-3106 SD-91814-001 0918143106
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 6 Circuits, Tin (Sn) over Nickel (Ni)

File Size 123.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-809081450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0918139106 91813-9106 SD-91813-001

Molex Electronics Ltd.
Part No. 0918139106 91813-9106 SD-91813-001
Description 5.08 (.200) Pitch, KK?, CRP Terminal HSG, Glow Wire compatible, 6 Circuits, White, with Ramp
5.08 (.200") Pitch, KK庐, CRP Terminal HSG, Glow Wire compatible, 6 Circuits, White, with Ramp

File Size 122.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-109081400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0918139103 SD-91813-001

Molex Electronics Ltd.
Part No. 0918139103 SD-91813-001
Description 5.08 (.200) Pitch, KK, CRP Terminal HSG, Glow Wire compatible, 3 Circuits, White, with Ramp
5.08 (.200") Pitch, KK, CRP Terminal HSG, Glow Wire compatible, 3 Circuits, White, with Ramp

File Size 122.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-409081400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0918143110 91814-3110 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143110 91814-3110 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 10 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 10 Circuits, Tin (Sn) over Nickel (Ni)

File Size 124.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-109081400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0918143112 91814-3112 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143112 91814-3112 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 12 Circuits, Tin (Sn)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 12 Circuits, Tin (Sn)

File Size 124.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-409081450LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0918143114 91814-3114 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143114 91814-3114 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 14 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 14 Circuits, Tin (Sn) over Nickel (Ni)

File Size 124.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-809081450LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0918143116 91814-3116 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143116 91814-3116 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 16 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 16 Circuits, Tin (Sn) over Nickel (Ni)

File Size 123.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 54111-109081405LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Stacking vertical header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0918139102 91813-9102 SD-91813-001

Molex Electronics Ltd.
Part No. 0918139102 91813-9102 SD-91813-001
Description 5.08 (.200) Pitch, KK, CRP Terminal HSG, Glow Wire compatible, 2 Circuits, White, with Ramp
5.08 (.200") Pitch, KK, CRP Terminal HSG, Glow Wire compatible, 2 Circuits, White, with Ramp

File Size 122.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 10091836-10J-20DLF
Description XCede® High Speed Backplane Connectors, 4 wall header.
Tech specs    

Official Product Page

    0918139007 91813-9007 SD-91813-001

Molex Electronics Ltd.
Part No. 0918139007 91813-9007 SD-91813-001
Description 5.08 (.200) Pitch, KK, CRP Terminal HSG, Glow Wire compatible, 7 Circuits, White, Glow Wire Compatible
5.08 (.200") Pitch, KK, CRP Terminal HSG, Glow Wire compatible, 7 Circuits, White, Glow Wire Compatible

File Size 122.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 54111-408091850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 9 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0918143122 91814-3122 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143122 91814-3122 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 22 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 22 Circuits, Tin (Sn) over Nickel (Ni)

File Size 124.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-109181700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 90814-0918 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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