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  90147-1303 Datasheet PDF File

For 90147-1303 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    T113030

E-SWITCH
Part No. T113030
Description All Dimension In MM

File Size 61.04K  /  1 Page

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Coilcraft Inc

Part No. 13031CL
Description Power choke, toroid, RoHS
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    2SA1303

Savantic, Inc.
Part No. 2SA1303
Description Silicon PNP Power Transistors

File Size 175.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3162-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    Panasonic Corporation
PANASONIC[Panasonic Semiconductor]
Part No. CNB1303
Description Reflective Photosensor

File Size 47.81K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-3162-15H
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    2SK1303

Hitachi Semiconductor
Part No. 2SK1303
Description Silicon N Channel MOS FET

File Size 51.06K  /  9 Page

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Amphenol Communications Solutions

Part No. 130-3182-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    T113037

E-SWITCH
Part No. T113037
Description All Dimension In MM

File Size 30.59K  /  1 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    71308-4230N 015-91-1303

Molex Electronics Ltd.
Part No. 71308-4230N 015-91-1303
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.63K  /  8 Page

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Amphenol Communications Solutions

Part No. 130-3182-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. BA01303
Description Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module

File Size 84.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 130-3142-15D
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    T113039

E-SWITCH
Part No. T113039
Description All Dimension In MM

File Size 26.82K  /  1 Page

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Amphenol Communications Solutions

Part No. 130-3182-15H
Description Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    MT1303A-UR-A

Marktech Corporate
Part No. MT1303A-UR-A
Description 3.0mm ROUND LED LAMP

File Size 176.04K  /  6 Page

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Amphenol Communications Solutions

Part No. 130-3162-15D
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    Solomon
Part No. SSD1303
Description 132 x 64 Dot Matrix OLED/PLED Segment/Common Driver

File Size 656.60K  /  56 Page

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Amphenol Communications Solutions

Part No. 130-3142-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

For 90147-1303 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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