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  87762-1633 Datasheet PDF File

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    0908163324

Molex Electronics Ltd.
Part No. 0908163324
Description 1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 24 Circuits, Gold (Au) Plating, Black
File Size 212.17K  /  4 Page

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Rochester Electronics LLC
Part No. DS1633J-8/B
Description DS1633 - CMOS Dual Peripheral Drivers
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    90816-3314 0908163314

Molex Electronics Ltd.
Part No. 90816-3314 0908163314
Description 1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 14 Circuits, Gold (Au) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 14 Circuits, Gold (Au) Plating, Black
File Size 212.32K  /  4 Page

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Amphenol Communications Solutions
Part No. 68016-336HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    K4M281633F K4M281633F-C K4M281633F-F1L K4M281633F-G K4M281633F-L K4M281633F-N K4M281633F-RE

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4M281633F K4M281633F-C K4M281633F-F1L K4M281633F-G K4M281633F-L K4M281633F-N K4M281633F-RE
Description 2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行54FBGA移动SDRAM
File Size 111.99K  /  12 Page

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Amphenol Communications Solutions
Part No. 68016-336H
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

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    Samsung Electronic
Part No. K4S561633C-RLN
Description 4M x 16Bit x 4 Banks Synchronous DRAM in 54CSP Data Sheet
File Size 674.11K  /  47 Page

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Amphenol Communications Solutions
Part No. 68016-336
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    UPD16337 UPD16337GF-3BA

NEC[NEC]
Part No. UPD16337 UPD16337GF-3BA
Description 64-BIT AC-PDP DRIVER
File Size 100.76K  /  16 Page

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Amphenol Communications Solutions
Part No. 10163352-R0030YYLF
Description Crimped lead of Minitek 0.80mm pitch with Tin plated terminals. Standard cable of 300mm length in receptacle-to-receptacle configurations. Wire size AWG 30.
Tech specs 　 　

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    Samsung Electronic
Part No. K4S641633F-GLN
Description 1M x 16Bit x 4 Banks SDRAM in 54CSP Data Sheet
File Size 68.85K  /  10 Page

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Amphenol Communications Solutions
Part No. 10163354-P0030YYLF
Description Crimped lead of Minitek 1.25mm pitch with Tin plated terminals. Standard cable of 300mm length in receptacle-to-receptacle configurations. Wire size AWG 28.
Tech specs 　 　

Official Product Page

    K4S561633F K4S561633F-C K4S561633F-E K4S561633F-F1H K4S561633F-F1L K4S561633F-F75 K4S561633F-G K4S561633F-L K4S561633F-N

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S561633F K4S561633F-C K4S561633F-E K4S561633F-F1H K4S561633F-F1L K4S561633F-F75 K4S561633F-G K4S561633F-L K4S561633F-N K4S561633F-X K4S561633F-XE
Description 4M x 16Bit x 4 Banks Mobile SDRAM in 54BOC
File Size 111.69K  /  12 Page

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Amphenol Communications Solutions
Part No. 10137926-1633LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Natural Color, 16 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    K4S281633D-N1H K4S281633D-N1L K4S281633D-N75 K4S281633D-RL

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S281633D-N1H K4S281633D-N1L K4S281633D-N75 K4S281633D-RL
Description IC REG ULDO DUAL 2.8/1.5V 6-MLF
8Mx16 SDRAM 54CSP
2M x 16Bit x 4 Banks SDRAM in 54CSP Data Sheet
File Size 66.22K  /  10 Page

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Amphenol Communications Solutions
Part No. 10163355-P0030YYLF
Description Crimped lead of Minitek 1.50mm pitch with Tin plated terminals. Standard cable of 300mm length in receptacle-to-receptacle configurations. Wire size AWG 28.
Tech specs 　 　

Official Product Page

    K4S511633F-YPC K4S511633F K4S511633F-F1H K4S511633F-F1L K4S511633F-F75 K4S511633F-L K4S511633F-YC

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S511633F-YPC K4S511633F K4S511633F-F1H K4S511633F-F1L K4S511633F-F75 K4S511633F-L K4S511633F-YC
Description 8M x 16Bit x 4 Banks Mobile SDRAM 8米16 × 4银行移动SDRAM
File Size 111.06K  /  12 Page

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Amphenol Communications Solutions
Part No. 10163353-P0030YYLF
Description Crimped lead of Minitek 1.00mm pitch with Tin plated terminals. Standard cable of 300mm length in receptacle-to-receptacle configurations. Wire size AWG 30.
Tech specs 　 　

Official Product Page

    TE Connectivity Ltd
Part No. 1-455889-4 22733-8 354777-1 1633091-1
Description    SHOULD BE CONTACTED FOR THE LATEST REVISION.
File Size 471.02K  /  1 Page

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Amphenol Communications Solutions
Part No. G42V16332HR
Description Mini Cool Edge IO(MCIO), PCIe Gen4, Surfacemount, Vertical, 148 Pin, PCIe, SAS, SFP, NVMe, cable, dual, card.
Tech specs 　 　

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