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  87760-4416 Datasheet PDF File

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    0877600817 87760-0817

Molex Electronics Ltd.
Part No. 0877600817 87760-0817
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 154.96K  /  4 Page

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Texas Instruments

Part No. 5962-8776001SRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877600816 87760-0816

Molex Electronics Ltd.
Part No. 0877600816 87760-0816
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 155.05K  /  4 Page

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Texas Instruments

Part No. 5962-8776001MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    0877600627 87760-0627

Molex Electronics Ltd.
Part No. 0877600627 87760-0627
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Mating Length: 3.50mm (.138), 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, Tray, Lead-free

File Size 155.11K  /  4 Page

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Texas Instruments

Part No. 5962-8776001M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs    

Official Product Page

    0877600626 87760-0626

Molex Electronics Ltd.
Part No. 0877600626 87760-0626
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Mating Length: 3.50mm (.138), 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray, Lead-free

File Size 155.11K  /  4 Page

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Texas Instruments

Part No. 5962-8776001SSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    0877600617 87760-0617

Molex Electronics Ltd.
Part No. 0877600617 87760-0617
Description 2.00mm (.079 0.76渭m (30渭") Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 154.96K  /  4 Page

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Texas Instruments

Part No. 5962-8776001MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    0877600417 87760-0417

Molex Electronics Ltd.
Part No. 0877600417 87760-0417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 154.96K  /  4 Page

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Amphenol Communications Solutions

Part No. 68024-416HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    0877600416 87760-0416

Molex Electronics Ltd.
Part No. 0877600416 87760-0416
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 155.05K  /  4 Page

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Amphenol Communications Solutions

Part No. 91614-416LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry, Single Row, 16 Position ,2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0877601818

Molex Electronics Ltd.
Part No. 0877601818
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 18 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free

File Size 160.06K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4416-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0877601817

Molex Electronics Ltd.
Part No. 0877601817
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 68764-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87760-5016 0877605016

Molex Electronics Ltd.
Part No. 87760-5016 0877605016
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Right Angle, Through Hole, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 68004-416HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

For 87760-4416 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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