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Molex Electronics Ltd.
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| Part No. |
0713086472
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30
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| File Size |
1,475.71K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
RJSGE4887381
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| Description |
Modular Jack - 8P8C, Right Angle, Cat5e, Four Port, Stacked, 2x2, Shield With Top and Side EMI Tabs, With LEDs, Press-fit Contacts
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086478
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| Description |
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50μm (59u) Minimum
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50楼矛m (59u") Minimum
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE4W4887381
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| Description |
Modular Jacks, Input Output Connectors, 8P8C, Cat5e, Stacked 2x2, Shield, With LEDs
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086476
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-108641400LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086474
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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|
|
Amphenol Communications Solutions |
| Part No. |
54122-808641400LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0873812264 87381-2264
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Surface Mount, Top Entry, 0.38μm (15μ) Gold (Au) Plating, with Cap, without Locating Pegs, 22 Circuits
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38μm (15μ) Gold (Au) Plating, with Cap, without Locating Pegs, 22 Circuits
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| File Size |
315.45K /
6 Page |
View
it Online |
Download Datasheet |
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