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  70567-0125 Datasheet PDF File

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    0015800165 15-80-0165 70567-0142 A-70567-0142

Molex Electronics Ltd.
Part No. 0015800165 15-80-0165 70567-0142 A-70567-0142
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

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Amphenol Communications Solutions

Part No. 10125112-080012CLF
Description HPCE BTB R/A Receptacle 8P12S WITH GUIDE
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800149 15-80-0149 A-70567-0277

Molex Electronics Ltd.
Part No. 0015800149 15-80-0149 A-70567-0277
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 10125023-080012ALF
Description HPCE BTB VT RECEPT 8P12S
Tech specs    

Official Product Page

    0015800147 15-80-0147 A-70567-0209

Molex Electronics Ltd.
Part No. 0015800147 15-80-0147 A-70567-0209
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating

File Size 1,218.31K  /  7 Page

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Amphenol Communications Solutions

Part No. 10072353-G01-25ULF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 50 Positions - 2mm (0.079inch) - Right Angle
Tech specs    

Official Product Page

    0015800381 70567-0017 15-80-0381

Molex Electronics Ltd.
Part No. 0015800381 70567-0017 15-80-0381
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating

File Size 1,218.40K  /  7 Page

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Amphenol Communications Solutions

Part No. 10075024-F01-25ULF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 50 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    A-70567-0363 15-80-1501 0015801501

Molex Electronics Ltd.
Part No. A-70567-0363 15-80-1501 0015801501
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 10112684-F01-25ULF
Description Unshrouded Right Angle Headers - Surface Mount - Single row - 25 Positions - 2.00mm (0.079in)
Tech specs    

Official Product Page

    Union Semiconductor, Inc.
Part No. UM50125 UM50129
Description Single Line ESD Protection Diode Array

File Size 207.73K  /  7 Page

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Amphenol Communications Solutions

Part No. 10112690-F01-25ULF
Description Header, Surface Mount, Double row, 50, 2mm (0.079in), Right Angle
Tech specs    

Official Product Page

    A-70567-0102 0015800723

Molex Electronics Ltd.
Part No. A-70567-0102 0015800723
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 10125025-002LF
Description HPCE VT Receptacle 20P Omit 4P
Tech specs    

Official Product Page

    0015800507 A-70567-0227 15-80-0507

Molex Electronics Ltd.
Part No. 0015800507 A-70567-0227 15-80-0507
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.49K  /  7 Page

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Amphenol Communications Solutions

Part No. 54122-109201250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    A-70567-0283 0015800269

Molex Electronics Ltd.
Part No. A-70567-0283 0015800269
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 10125837-001SPGLF
Description 10125837-001SPGLF-SMALL MOQ VERSION
Tech specs    

Official Product Page

    A-70567-0101 15-80-0703 0015800703

Molex Electronics Ltd.
Part No. A-70567-0101 15-80-0703 0015800703
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,

File Size 1,218.28K  /  7 Page

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Amphenol Communications Solutions

Part No. 10125138-080400BLF
Description HPCE STD VT Receptacle 12P
Tech specs    

Official Product Page

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