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  51338-0874 Datasheet PDF File

For 51338-0874 Found Datasheets File :: 104+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 |   

    TCD2901D EE08749

TOSHIBA[Toshiba Semiconductor]
Part No. TCD2901D EE08749
Description From old datasheet system
CCD IMAGE SENSOR

File Size 443.53K  /  13 Page

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Amphenol Communications Solutions

Part No. 10087452-102HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Press Fit, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0874270843 87427-0843

Molex Electronics Ltd.
Part No. 0874270843 87427-0843
Description 4.20mm (.165) Mini-Fit Jr. Header, Vertical, High Temperature, without Flange, 8Circuits, Tin (Sn) over Copper (Cu) Plating, Glow Wire Compatible

File Size 228.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 10087452-106HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Press Fit, Single Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0874270842 87427-0842

Molex Electronics Ltd.
Part No. 0874270842 87427-0842
Description 4.20mm (.165") Mini-Fit Jr. Header, Vertical, High Temperature, without Flange, 8 Circuits
4.20mm (.165) Mini-Fit Jr. Header, Vertical, High Temperature, without Flange, 8 Circuits

File Size 228.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 10087452-110001HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Press Fit, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0874270802 87427-0802

Molex Electronics Ltd.
Part No. 0874270802 87427-0802
Description 4.20mm (.165) Mini-Fit Jr. Header, Right Angle, High Temperature, without Flange8 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible

File Size 245.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 10150874-102LF
Description AirMAX VS2®, Backplane Connectors, 5-Pair, 8 Column, 120-Position, 2.0mm, , Right Angle Header, Press-Fit
Tech specs    

Official Product Page

    0874270443

Molex Electronics Ltd.
Part No. 0874270443
Description
File Size 245.89K  /  4 Page

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Amphenol Communications Solutions

Part No. 10087452-110HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Press Fit, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0874270603

Molex Electronics Ltd.
Part No. 0874270603
Description
File Size 160.55K  /  4 Page

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    0874270612 87427-0612

Molex Electronics Ltd.
Part No. 0874270612 87427-0612
Description 4.20mm (.165) Mini-Fit Jr. Header, Right Angle, High Temperature, with Flange, 6 Circuits
4.20mm (.165) Mini-Fit Jr.?/a> Header, Right Angle, High Temperature, with Flange, 6 Circuits

File Size 160.54K  /  4 Page

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    0874270613

Molex Electronics Ltd.
Part No. 0874270613
Description
File Size 220.71K  /  4 Page

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    0874270642 87427-0642

Molex Electronics Ltd.
Part No. 0874270642 87427-0642
Description 4.20mm (.165) Mini-Fit Jr. Header, Vertical, High Temperature, without Flange, 6 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible
4.20mm (.165) Mini-Fit Jr.?/a> Header, Vertical, High Temperature, without Flange, 6 Circuits, Tin (Sn) over Nickel (Ni) Plating, Glow Wire Compatible

File Size 228.91K  /  4 Page

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    0874270643

Molex Electronics Ltd.
Part No. 0874270643
Description
File Size 245.89K  /  4 Page

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