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  43650-0826 Datasheet PDF File

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    43650-0904

Molex Electronics Ltd.
Part No. 43650-0904
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with Press-fit Metal Retention Clip, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 152.16K  /  3 Page

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Renesas Electronics Corporation
Part No. M30826MH-XXXGP
Description 32-bit Microcomputers (Non Promotion), , /
Tech specs 　 　

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HUA FENG CIRCUIT





    43650-0811

Molex Electronics Ltd.
Part No. 43650-0811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with PCB Press-fit Metal Retention Clip, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 163.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-808260900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    DB Unlimited.
Part No. TE082603-2
Description Released from Engineering
File Size 725.01K  /  1 Page

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Amphenol Communications Solutions
Part No. 98414-G08-26ULF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header, Through Hole, Double Row, 26 Position ,2.00mm (0.079in) Pitch.
Tech specs 　 　

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    SD-43650-001 43650-0602

Molex Electronics Ltd.
Part No. SD-43650-001 43650-0602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Snap-in
File Size 161.64K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-082606LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    SD-43650-004 43650-0709

Molex Electronics Ltd.
Part No. SD-43650-004 43650-0709
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with PCB Press
File Size 162.97K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-082600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    SD-43650-002 43650-0605

Molex Electronics Ltd.
Part No. SD-43650-002 43650-0605
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Press-fit Metal Retention Clip
File Size 152.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 61082-082600LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    SD-43650-002 43650-0705

Molex Electronics Ltd.
Part No. SD-43650-002 43650-0705
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Press-fit Metal Retention
File Size 152.07K  /  3 Page

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Amphenol Communications Solutions
Part No. 61082-082602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs 　 　

Official Product Page

    43650-0712 SD-43650-005

Molex Electronics Ltd.
Part No. 43650-0712 SD-43650-005
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Solder Tab
File Size 152.47K  /  3 Page

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Amphenol Communications Solutions
Part No. 10082627-404HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    Molex, Inc.
Part No. 43045-0224 43045-1225 43045-0826 43045-0825 43045-0624 43045-0824
Description Header; No. of Contacts:2; Pitch Spacing:3mm; No. of Rows:2; Series:Micro-Fit; Connector Body Material:Polymer; Mounting Type:PC Board; Terminal Type:Straight Pin POWER CONNECTOR
Header; No. of Contacts:12; Pitch Spacing:3mm; No. of Rows:2; Series:Micro-Fit; Connector Body Material:Polymer; Mounting Type:PC Board; Terminal Type:Straight Pin POWER CONNECTOR
MicroFit 3.0 V TH /Clip DR 30Au 8Ckt POWER CONNECTOR
Microfit 3.0 Vert PTH /clip DR 15Au 8Ckt POWER CONNECTOR
430450624 POWER CONNECTOR
HEADER, MICROFIT 3.0, 8POS POWER CONNECTOR
File Size 76.86K  /  1 Page

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Amphenol Communications Solutions
Part No. 54122-108261000LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 26 Positions
Tech specs 　 　

Official Product Page

    TE Connectivity Ltd
Part No. 68304-1 308264-2 308264-3 308264-4 308265-4 308266-1
Description AMPOWER Crimping Die Assemblies
File Size 312.45K  /  5 Page

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Amphenol Communications Solutions
Part No. 130-8262-15D
Description Paladin Plus 8-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs 　 　

Official Product Page

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