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Amphenol Communications Solutions |
| Part No. |
77319-103-72LF
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| Description |
BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77319-104-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131931-919ULF
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| Description |
Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 19 Positions, 2mm (0.079inch), horizontal.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77319-103-04LF
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| Description |
BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 04 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131319-16221G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 16 Positions, GW Compatible Nylon66, Tray Packing.
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Official Product Page
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King Billion Electronics Co., Ltd.
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| Part No. |
HE83R125
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| Description |
This chip is suitable for the applications that require higher performance
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| File Size |
326.13K /
18 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10131319-1221100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131319-10211G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77319-103-22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75188-319-18LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch.
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Official Product Page
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ST Microelectronics
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| Part No. |
ST23R160
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| Description |
ST23 Dual Interface Secure MCU with 160 KBytes EEPROM, enhanced security and Nescrypt cryptoprocessor, RF Type B (Contectless High end ID-Passport/PKI)
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| File Size |
173.85K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10131319-122110PLF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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