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TC9090AN C1875 MBT5401 ATION 0015453 SIR333 76051 1N824A
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  161.53000 Datasheet PDF File

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    1614-PG-WW-02 1614-PG-WW-08 1614-SC-WW-02 1614-FC-WW-02 1614-SC-WW-08 1614-FC-WW-08

Emcore Corporation
Part No. 1614-PG-WW-02 1614-PG-WW-08 1614-SC-WW-02 1614-FC-WW-02 1614-SC-WW-08 1614-FC-WW-08
Description 1310 nm DFB Laser Module
File Size 224.80K  /  6 Page

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Renesas Electronics Corporation
Part No. 7MPV6253-000
Description SRAM MODULE
Tech specs 　 　

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HUA FENG CIRCUIT





    W161

CYPRESS[Cypress Semiconductor]
Part No. W161
Description 133-MHz Spread Spectrum FTG for Pentium II Platforms
File Size 116.34K  /  9 Page

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Renesas Electronics Corporation
Part No. DA14530-00FXDB-P
Description SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
Tech specs 　 　

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    14-44-1617

Molex Electronics Ltd.
Part No. 14-44-1617
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 17 Circuits
File Size 148.30K  /  2 Page

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Renesas Electronics Corporation
Part No. DA14530-00FXDEVKT-P
Description SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
Tech specs 　 　

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    14-44-1619

Molex Electronics Ltd.
Part No. 14-44-1619
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 19 Circuits
File Size 148.30K  /  2 Page

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Renesas Electronics Corporation
Part No. DA14530-00000FX2
Description SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
Tech specs 　 　

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    AC-161A

ETC
Part No. AC-161A
Description LCD_Module
File Size 369.59K  /  1 Page

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Amphenol Communications Solutions
Part No. 55530-001
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, Polarized, 44 Positions ,2.00mm (0.079in) Pitch
Tech specs 　 　

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    14-44-1616

Molex Electronics Ltd.
Part No. 14-44-1616
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.38μm (15μ) Gold (Au), 16 Circuits
File Size 149.43K  /  3 Page

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Amphenol Communications Solutions
Part No. FLSC80353000
Description DOME COVER 80 mm DIA, 35 mm high, FLS Series - RED
Tech specs 　 　

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    9161

List of Unclassifed Manufacturers
Part No. 9161
Description ACCEPTS ONE 14 OR 16-PIN S.O.I.C. or TWO 8-PIN SOICs PERIPHERAL BREADBOARDING AREA
File Size 153.95K  /  1 Page

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Amphenol Communications Solutions
Part No. 10119109-530007LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

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    Allegro
Part No. 3161
Description HALL-EFFECT SWITCH FOR 2-WIRE APPLICATIONS
From old datasheet system
File Size 124.95K  /  8 Page

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Amphenol Communications Solutions
Part No. FLSC80753000
Description DOME COVER 80 mm DIA, 75 mm high, FLS Series - RED
Tech specs 　 　

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    UTC[Unisonic Technologies]
Part No. 1618
Description 6 KEYS SIREN/ALARM SOUND GENERATOR
File Size 37.74K  /  4 Page

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Amphenol Communications Solutions
Part No. 48253-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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    UTC
Part No. 1617
Description 6 TONES SIREN/ALARM SOUND GENERATOR
File Size 56.39K  /  3 Page

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Amphenol Communications Solutions
Part No. 84530-002
Description 200 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs 　 　

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