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wire-in-air Datasheet PDF File

For wire-in-air Found Datasheets File :: 10123 Search Time::5.156ms
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				Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPXT4100 MPXT4100A7U MPXT4101A7U MPXT4105A7U
OCR Text	...STAINLESS STEEL METAL COVER DIE WIRE BONDS P1 FLUORO SILICONE DIE COAT Figure 2. Cross Sectional Diagram (Not to Scale) Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 473). A fluorosilicone gel isolates the...
Description	X-ducer SILICON PRESSURE SENSORS ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.17-15.22Psi, 1.8%, 0.30-4.90V, SQUARE, THROUGH HOLE MOUNT
File Size	131.75K / 8 Page	View it Online	Download Datasheet

				MICRO-ELECTRONICS[Micro Electronics]
Part No.	TH8055
OCR Text	Wire CAN Transceiver Features and Benefits Fully compatible with J2411 Single Wire CAN specification for Class B in vehicle communications 30 A typical power consumption in sleep mode independent from CAN voltage range Operating voltage r...
Description	Single Wire CAN Transceiver
File Size	264.84K / 15 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	TH8080 TH8080JDC
OCR Text	wire LIN transceiver Compatible to LIN Protocol Specification, Rev. 1.1 Compatible to ISO9141 functions Up to 20 kbps bus speed Low RFI due ...in the automotive environment Very low (30 A) typical power consumption in recessive state and there...
Description	Single LIN Bus Transceiver
File Size	154.38K / 12 Page	View it Online	Download Datasheet

				AD[Analog Devices]
Part No.	ADUC812 ADUC812BS
OCR Text	...pack UART Serial I/O package. 2-Wire (I 2C (R)-Compatible) and SPI (R) Serial I/O Watchdog Timer Power Supply Monitor FUNCTIONAL BLOCK DIAGR...in production at V DD = 5 V after Software Calibration Routine at +25C only. 6 User may need to exec...
Description	MicroConverter⑩, Multichannel 12-Bit ADC with Embedded FLASH MCU MicroConverter?? Multichannel 12-Bit ADC with Embedded FLASH MCU MicroConverter Multichannel 12-Bit ADC with Embedded FLASH MCU MicroConverter, Multichannel 12-Bit ADC with Embedded FLASH MCU
File Size	540.57K / 31 Page	View it Online	Download Datasheet

				UMS[United Monolithic Semiconductors]
Part No.	CHV2240 CHV2240-99F_00 CHV2240-99F/00
OCR Text	... For the RF pads the equivalent wire bonding inductance (diameter=25m) have to be according to the following recommendation. Port ERC (2) RF...in the substrate is recommended for chip assembly. Ref. :DSCHV22400096 -05-Apr-00 4/8 Speci...
Description	Multifunction : K-band VCO and Q-band Multiplier
File Size	348.58K / 8 Page	View it Online	Download Datasheet

				UMS[United Monolithic Semiconductors]
Part No.	CHV2241 CHV2241-99F_00 CHV2241-99F/00
OCR Text	... For the RF pads the equivalent wire bonding inductances (diameter=25m) have to be according to the following recommendation. Equivalent ind...in the substrate is recommended for chip assembly. Ref. : DSCHV22411074 -15-Mar.-01 5/8 Spe...
Description	K-band Oscillator with integrated Q-band Harmonic Mixer
File Size	212.18K / 8 Page	View it Online	Download Datasheet

				UMS[United Monolithic Semiconductors]
Part No.	CHV2242A CHV2242A-99F_00 CHV2242A-99F/00
OCR Text	... For the RF pads the equivalent wire bonding inductance (diameter=25m) has to be according to the following recommendation. Port ERC1 (2) ER...in the substrate is recommended for chip assembly. Ref. : DSCHV22421074 -15-Mar.-01 4/8 Spe...
Description	Q-band VCO based on Ku-band Oscillator and Q-band Multiplier
File Size	809.51K / 8 Page	View it Online	Download Datasheet

				UMS[United Monolithic Semiconductors]
Part No.	CHV2243 CHV2243-99F_00 CHV2243-99F/00
OCR Text	... For the RF pads the equivalent wire bonding inductance (diameter=25m) has to be according to the following recommendation. Equivalent induc...in the substrate is recommended for chip assembly. Ref. : DSCHV22431074 -15-Mar.-01 5/6 Specificati...
Description	Fully Integrated Q-band VCO based on Ku-band Oscillator and Q-band Multiplier
File Size	96.71K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc] MOTOROLA[Motorola Inc]
Part No.	MPXV2053DP MPXV2053G MPXV2053GP MPX2053D MPX2053GSX MPX2053GVP MPX2053 MPX2053DP MPX2053GP
OCR Text	... TYP SPAN RANGE (TYP) MIN WIRE BOND SILICONE DIE COAT STAINLESS STEEL METAL COVER DIE P1 EPOXY CASE 12.5 1.8 25 3.6 37....in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from th...
Description	50 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors 50 KPA ON CHIP TEMPERATURE COMPENSATED CALIBRATED SILICON PRESSURE SENSORS
File Size	185.37K / 12 Page	View it Online	Download Datasheet

				Freescale (Motorola) ETC[ETC]
Part No.	MPXV5004DP MPXV5004G MPXV5004G6T1 MPXV5004G6U MPXV5004G7U MPXV5004GC6T1 MPXV5004GC7U MPXV5004GP MPXV5004GVP MPXV5004
OCR Text	...el isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphra...in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of...
Description	Integrated Pressure Sensor Integrated Silicon Pressure Sensor On-Chip Signal Conditioned Temperature Compensated and Calibrated Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	263.36K / 12 Page	View it Online	Download Datasheet

For wire-in-air Found Datasheets File :: 10123 Search Time::5.156ms
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