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  wire-bond Datasheet PDF File

For wire-bond Found Datasheets File :: 3708    Search Time::1.297ms    
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    TC1706

Transcom, Inc.
Part No. TC1706
OCR Text ...rmo-compression or thermo-sonic wire bonding. backside gold plating is compatible with standard ausn die-attach. typical applications inclu...bond method is thermocompression bonding with 0.7 to 1.0 mil (0.018 to 0.025 mm) gold wire. stage t...
Description 3 W High Linearity and High Efficiency GaAs Power FETs

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    HMC259 HMC25901

Hittite Microwave Corporation
Part No. HMC259 HMC25901
OCR Text ...ed via 0.025mm (1 mil) diameter wire bonds of minimal length <0.31mm (<12 mils). This device is a much smaller and more reliable replacement...BOND PADS ARE 0.100 (0.004) SQUARE BOND PAD SPACING, CTR-CTR: 0.150 (0.006) BACKSIDE METALLIZATION: ...
Description GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 28 - 40 GHz

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    HMMC-5034

Agilent(Hewlett-Packard)
Part No. HMMC-5034
OCR Text ...rom the rf-output port. a bond wire attaching both v d2 bond pads to the supply will assure symmetric operation and minimize any dc offset voltage between det.ref and det.out (at no rf output power). no ground wires are needed be- cau...
Description 37-43 GHz MMIC Power Amplifier(37-43 GHz单片微波集成电路功率放大

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    XC2V1000-4CS144C XC2V1000-4CS144I XC2V1000-4FG256C XC2V1000-4FG256I XC2V1000-4FG456C XC2V1000-4FG456I XC2V40-4CS144C XC2

Xilinx, Inc.
XILINX INC
Part No. XC2V1000-4CS144C XC2V1000-4CS144I XC2V1000-4FG256C XC2V1000-4FG256I XC2V1000-4FG456C XC2V1000-4FG456I XC2V40-4CS144C XC2V40-4CS144I XC2V40-4FG256C XC2V40-4FG256I XC2V40-4FG456C XC2V40-4FG456I XC2V1000-5FG256C XC2V1000-5FG256I XC2V1000-5FG456C XC2V1000-5FG456I XC2V80-4FG256C XC2V250-4FG256C XC2V500-4FG256C XC2V1500-4FG256C XC2V2000-4FG256C XC2V4000-4FG256C XC2V6000-4FG256C XC2V8000-4FG256C XC2V1500-6CS144C XC2V1000-6CS144C XC2V40-6CS144C XC2V500-6CS144C XC2V80-6CS144C XC2V250-6FG256C XC2V250-6FG256I XC2V250-6FG456C XC2V80-4CS144C XC2V80-4CS144I XC2V40-6FG456C XC2V40-6FG256C XC2V40-6FG256I XC2V40-6FG456I XC2V40-5FG256I XC2V40-5FG256C XC2V40-5FG456C XC2V40-5FG456I XC2V2000-4CS144C XC2V2000-4CS144I XC2V2000-4FG256I XC2V2000-4FG456C XC2V2000-4FG456I XC2V2000-5CS144C XC2V250-5FG256C XC2V250-5FG256I XC2V250-5CS144C XC2V250-5CS144I XC2V250-4FG256I XC2V250-4FG456C XC2V1500-4CS144C XC2V1500-4CS144I XC2V1500-4FG256I XC2V1500-4FG456C XC2V6000-4CS144C XC2V6000-4CS144I XC2V80-6FG256I XC2V80-5FG256I XC2V80-5FG456C XC2V80-5FG256C XC2V80-5CS144C XC2V80-4FG256I XC2V80-6FG256C XC2V80-6FG456C XC2V80-4FG456C XC2V1000-4BGG575C XC2V1500-4BGG575C XC2V2000-4FFG896C XC2V2000-4FFG896I XC2V2000-5FFG896C XC2V2
OCR Text ...can Logic Support Flip-Chip and wire-bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm) wire-bond BGA Devices Available in Pb-Free Packaging (www.xilinx.com/pbfree) 100% Factory Tested * ...
Description Virtex-II Platform FPGAs: Complete Data Sheet
1000000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 1280 CLBS, 1000000 GATES, 650 MHz, PBGA575
1500000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 1920 CLBS, 1500000 GATES, 650 MHz, PBGA575
XC2V2000-4FFG896C FPGA, 2688 CLBS, 2000000 GATES, 650 MHz, PBGA896
XC2V2000-4FFG896I FPGA, 2688 CLBS, 2000000 GATES, 650 MHz, PBGA896
XC2V2000-5FFG896C FPGA, 2688 CLBS, 2000000 GATES, 750 MHz, PBGA896
XC2V2000-5FFG896I FPGA, 2688 CLBS, 2000000 GATES, 750 MHz, PBGA896
XC2V8000-4FFG1517C FPGA, 11648 CLBS, 8000000 GATES, 650 MHz, PBGA1517
250000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 384 CLBS, 250000 GATES, 650 MHz, PBGA256
1000000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 1280 CLBS, 1000000 GATES, 750 MHz, PBGA575
XC2V4000-6FFG1517C FPGA, 5760 CLBS, 4000000 GATES, 820 MHz, PBGA1517
2000000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 2688 CLBS, 2000000 GATES, 650 MHz, PBGA575
2000000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 2688 CLBS, 2000000 GATES, 750 MHz, PBGA575
XC2V1000-4FFG896C FPGA, 1280 CLBS, 1000000 GATES, 650 MHz, PBGA896
XC2V8000-4FFG1152C FPGA, 11648 CLBS, 8000000 GATES, 650 MHz, PBGA1152
XC2V3000-5FFG1152C FPGA, 3584 CLBS, 3000000 GATES, 750 MHz, PBGA1152
250000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 384 CLBS, 250000 GATES, 750 MHz, PBGA144
40000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 64 CLBS, 40000 GATES, 750 MHz, PBGA144
1000000 SYSTEM GATE 1.5 VOLT FPGA FPGA, 1280 CLBS, 1000000 GATES, 650 MHz, PBGA256
FPGA, 384 CLBS, 250000 GATES, 820 MHz, PBGA456
FPGA, 768 CLBS, 500000 GATES, 820 MHz, PBGA456
FPGA, 3584 CLBS, 3000000 GATES, 820 MHz, PBGA1152
XC2V4000-4BFG957C
XC2V6000-4BFG957I

File Size 2,362.81K  /  318 Page

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    Mimix Broadband, Inc.
MIMIX BROADBAND INC
Part No. XQ1001-BD-000V XQ1001-BD-EV1
OCR Text ... are critical during placement. wire bonding - windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. the recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x...
Description 5.8-6.9 GHz GaAs MMIC Voltage Controlled Oscillator VCO, 5800 MHz - 6900 MHz

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    HMC941

Hittite Microwave Corporation
Part No. HMC941
OCR Text ...sible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004") Thick GaAs MMIC Wire Bond 0.076mm (0.003") 1 ATTENUATORS - DIGITAL - CHIP 1-6 RF Ground Plane ...
Description 0.5 dB LSB GaAs MMIC 5-BIT DIGITAL ATTENUATOR, 0.1 - 30 GHz

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    Micross Components
Part No. HMC341
OCR Text ... via 0.025 mm (1 mil) diameter wire bonds of minimal length 0.31 mm (<12 mils). excellent noise figure: 2.5 db gain: 13 db single supply: ...bond is .004 square 4. backside metallization: gold 5. bond pad metallization: gold 6. backside...
Description Millimeterwave Point-to-Point Radios

File Size 879.90K  /  9 Page

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    FMS20271 FMS2027-000

Filtronic Compound Semiconductors
Part No. FMS20271 FMS2027-000
OCR Text ...mended that 25.4m diameter gold wire be used. Thermosonic ball bonding is preferred. A nominal stage temperature of 150C and a bonding force...bond force should not be raised above 60g. Thermosonic wedge bonding and thermocompression wedge bon...
Description DC-20 GHZ MMIC SPDT ABSORPTIVE SWITCH

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    Mimix Broadband, Inc.
MIMIX BROADBAND INC
Part No. XQ1006-BD-000V XQ1006-BD-EV1
OCR Text ... are critical during placement. wire bonding - windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. the recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x...
Description 14.7-15.7 GHz GaAs MMIC Voltage Controlled Oscillator

File Size 389.10K  /  5 Page

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    XC2VP50 XC2VP70 XC2VP20 XC2VPX20 XC2VP40 XC2VPX70 XC2VP100 XC2VP20-6FF1152C XC2VP20-7FF1152C XC2VP7-5FF672C XC2VP7-6FF67

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Xilinx, Inc.
XILINX INC
Part No. XC2VP50 XC2VP70 XC2VP20 XC2VPX20 XC2VP40 XC2VPX70 XC2VP100 XC2VP20-6FF1152C XC2VP20-7FF1152C XC2VP7-5FF672C XC2VP7-6FF672C XC2VP7-7FF672C XC2VP20-5FF1152I XC2VP7-5FF672I XC2VP20-7FG676C XC2VP20-5FG676C XC2VP20-7FF896C XC2VP7-5FF896C XC2VP20-6FG676I XC2VP7-5FGG456C XC2VP7-6FG456I XC2VP7-5FF896I XC2VP20-6FF896C XC2VP20-6FF896I XC2VP7-6FG456C XC2VP7-6FGG456C XC2VP20-7FGG676C XC2VP7-5FG456I XC2VP20-5FG676I XC2VP7-5FGG456I XC2VP7-6FGG456I XC2VP20-6FG676C XC2VP20-5FF1152C XC2VP7-6FF896C XC2VP20-6FGG676I XC2VP7-7FF896C XC2VPX20-6FF896C XC2VP4-6FGG256I XC2VP4-5FGG256C XC2VP4-5FG256C XC2VP30 XC2VP100-5FF1696C XC2VP100-6FF1704C XC2VP50-5FF1517C XC2VP20-6FFG1152I XILINXINC-XC2VPX20-6FFG896I XC2VPX20-5FFG896C XC2VP40-5FF1152I XC2VP40-5FF1152C XC2VP40-6FF1148I XC2VP40-5FGG676I DS083 VIRTEX-II
OCR Text ...ons Pinout Tables FG256/FGG256 wire-bond Fine-Pitch BGA Package FG456/FGG456 wire-bond Fine-Pitch BGA Package FG676/FGG676 wire-bond Fine-Pitch BGA Package FF672 Flip-Chip Fine-Pitch BGA Package FF896 Flip-Chip Fine-Pitch BGA Package FF114...
Description Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet
20880 LOGIC CELLS 8 ROCKET IOS 2 POWER P FPGA, 2320 CLBS, 1200 MHz, PBGA1152
20880 Logic Cells 8 Rocket IOs 2 Power P FPGA, 2320 CLBS, 1350 MHz, PBGA1152
11088 LOGIC CELLS 8 ROCKET IOS 1 POWER P FPGA, 1232 CLBS, 1050 MHz, PBGA672
11088 LOGIC CELLS 8 ROCKET IOS 1 POWER P FPGA, 1232 CLBS, 1200 MHz, PBGA672
11088 Logic Cells 8 Rocket IOs 1 Power P FPGA, 1232 CLBS, 1350 MHz, PBGA672
20880 Logic Cells 8 Rocket IOs 2 Power P FPGA, 2320 CLBS, 1050 MHz, PBGA1152
20880 Logic Cells 8 Rocket IOs 2 Power P FPGA, 2320 CLBS, 1350 MHz, PBGA676
20880 LOGIC CELLS 8 ROCKET IOS 2 POWER P FPGA, 2320 CLBS, 1050 MHz, PBGA676
20880 Logic Cells 8 Rocket IOs 2 Power P FPGA, 2320 CLBS, 1350 MHz, PBGA896
11088 LOGIC CELLS 8 ROCKET IOS 1 POWER P FPGA, 1232 CLBS, 1050 MHz, PBGA896
20880 Logic Cells 8 Rocket IOs 2 Power P FPGA, 2320 CLBS, 1200 MHz, PBGA676
11088 LOGIC CELLS 8 ROCKET IOS 1 POWER P FPGA, 1232 CLBS, 1050 MHz, PBGA456
11088 Logic Cells 8 Rocket IOs 1 Power P FPGA, 1232 CLBS, 1200 MHz, PBGA456
20880 LOGIC CELLS 8 ROCKET IOS 2 POWER P FPGA, 2320 CLBS, 1200 MHz, PBGA896
11088 LOGIC CELLS 8 ROCKET IOS 1 POWER P FPGA, 1232 CLBS, 1200 MHz, PBGA896
11088 Logic Cells 8 Rocket IOs 1 Power P FPGA, 1232 CLBS, 1350 MHz, PBGA896
74448 LOGIC CELLS 20 ROCKET IOS 2 POWER - NOT RECOMMENDED for NEW DESIGN FPGA, 2448 CLBS, 1200 MHz, PBGA896
6768 LOGIC CELLS 4 ROCKET IOS 1 POWER PC FPGA, 752 CLBS, 1200 MHz, PBGA256
6768 LOGIC CELLS 4 ROCKET IOS 1 POWER PC FPGA, 752 CLBS, 1050 MHz, PBGA256
99216 Logic Cells 20 Rocket IOs 2 Power FPGA, 11024 CLBS, 1050 MHz, PBGA1696
99216 Logic Cells 20 Rocket IOs 2 Power FPGA, 11024 CLBS, 1200 MHz, PBGA1704
53136 Logic Cells 16 Rocket IOs 2 Power FPGA, 5904 CLBS, 1050 MHz, PBGA1517
XC2VP20-6FFG1152I FPGA, 2320 CLBS, 1200 MHz, PBGA1152
XC2VPX20-5FFG896C - NOT RECOMMENDED for NEW DESIGN
43632 Logic Cells 12 Rocket IOs 2 Power
Summary of Features
   Summary of Features

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