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  tin-lead Datasheet PDF File

For tin-lead Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    MILL-MAX MFG CORP
Part No. 0397-0-15-15-06-01-04-0 0294-0-15-15-06-01-10-0
Description BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL

File Size 75.98K  /  1 Page

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    MILL-MAX MFG CORP
Part No. 2954-0-18-01-30-02-10-0
Description BERYLLIUM COPPER, TIN LEAD (100) OVER NICKEL FINISH, PCB TERMINAL

File Size 134.73K  /  2 Page

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    MILL-MAX MFG CORP
Part No. 0616-0-18-01-07-01-10-0
Description BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL

File Size 130.42K  /  2 Page

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    87914-1816

Molex Electronics Ltd.
Part No. 87914-1816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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    0879143203 87914-3203

Molex Electronics Ltd.
Part No. 0879143203 87914-3203
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free

File Size 759.86K  /  11 Page

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    0879144816

Molex Electronics Ltd.
Part No. 0879144816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.74K  /  48 Page

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    0879143016 87914-3016

Molex Electronics Ltd.
Part No. 0879143016 87914-3016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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    0879143216 87914-3216

Molex Electronics Ltd.
Part No. 0879143216 87914-3216
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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    0879143416 87914-3416

Molex Electronics Ltd.
Part No. 0879143416 87914-3416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.41K  /  48 Page

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    87914-2816 0879142816

Molex Electronics Ltd.
Part No. 87914-2816 0879142816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.54K  /  48 Page

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