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  tape packaging for high volume Datasheet PDF File

For tape packaging for high volume Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0878980554 87898-0554

Molex Electronics Ltd.
Part No. 0878980554 87898-0554
Description 2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38μm (15μ) Gold (Au) Plating, tape on Reel packaging, with Cap, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, tape on Reel packaging, with Cap, Lead-free

File Size 1,956.76K  /  22 Page

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    0878980568 87898-0568

Molex Electronics Ltd.
Part No. 0878980568 87898-0568
Description 2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54μm (100μ) Tin (Sn) Plating, tape on Reel packaging, with Cap, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, tape on Reel packaging, with Cap, Lead-free

File Size 1,180.29K  /  19 Page

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    Air Cost Control
Advanced Micro Devices, Inc.
Part No. AM29DL400T-80EE AM29DL400T-80EI AM29DL400T-80FC AM29DL400T-80EC AM29DL400T-80FE AM29DL400T-80FI AM29DL400B-80EI AM29DL400B-80FE AM29DL400B-80EE AM29DL400B-80EC AM29DL400T-80SE AM29DL400B-80FC AM29DL400T-80SC AM29DL400B-70FC AM29DL400B-90FC AM29DL400B-120FC AM29DL400B-120SE AM29DL400B-80SE AM29DL400T-120EC AM29DL400T-90EC AM29DL400T-70EC AM29DL400T-120FC AM29DL400T-70FC AM29DL400T-90FC AM29DL400T-90FE AM29DL400B-70FI AM29DL400B-120FI AM29DL400B-90FI AM29DL400B-80FI AM29DL400B-70EC AM29DL400B-90EC AM29DL400T-120EI AM29DL400T-90SE AM29DL400B-120EI AM29DL400T-120FE AM29DL400B-120SC AM29DL400B-70EI AM29DL400B-90FE AM29DL400T-120EE
Description -30V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7306 with Standard packaging
-30V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7306 with Lead Free packaging
-20V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7104 with Lead Free packaging
-30V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7328 with Lead Free packaging
30V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7303 with Standard packaging
80V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7380QPBF with Standard packaging
30V N-Channel PowerTrench MOSFET
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF9910 with Standard packaging
50V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Industrial version of our popular IRF7103PBF - standard packaging
55V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7341 with Lead Free packaging
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7101 with Lead Free packaging
-20V FETKY - MOSFET and Schottky Diode in a SO-8 package; Similar to IRF7322D1TR with Lead Free packaging on tape and Reel
-20V FETKY - MOSFET and Schottky Diode in a SO-8 package; Similar to IRF7422D2 with Lead Free packaging
30V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF9956 with Lead Free packaging
80V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7380 with Standard packaging
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7301 with Standard packaging
20V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7331 with Standard packaging
50V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7103 with Standard packaging
50V Dual N-Channel HEXFET Power MOSFET in a SO-8 package - Q101 Qualified; Similar to IRF7103Q with Lead-Free packaging
-20V Dual P-Channel HEXFET Power MOSFET in a TSSOP-8 package; A IRF7750 with Standard packaging
20V FETKY - MOSFET and Schottky Diode in a Micro 8 package; A IRF7521D1 with Standard packaging
55V Dual N-Channel HEXFET Power MOSFET in a SO-8 package designed and qualified for the industrial market; Industrial version of our popular IRF7341PBF - standard packaging EEPROM
EEPROM EEPROM
80V Dual N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7380 with Lead Free packaging
-12V Dual P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7329 with Standard packaging

File Size 614.93K  /  43 Page

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    HNC1-2.5P-12DSL HNC2-2.5P-10DS HNC2-2.5P-10DSL HNC2-2.5P-15DS HNC2-2.5P-15DSL HNC2-2.5P-2DS HNC2-2.5P-2DSL HNC2-2.5P-3DS

HIROSE ELECTRIC Co., Ltd.
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
Part No. HNC1-2.5P-12DSL HNC2-2.5P-10DS HNC2-2.5P-10DSL HNC2-2.5P-15DS HNC2-2.5P-15DSL HNC2-2.5P-2DS HNC2-2.5P-2DSL HNC2-2.5P-3DS HNC2-2.5P-3DSL HNC2-2.5P-4DS HNC2-2.5P-4DSL HNC2-2.5P-5DS HNC2-2.5P-5DSL HNC2-2.5P-6DS HNC2-2.5P-6DSL HNC2-2.5P-7DS HNC2-2.5P-7DSL HNC2-2.5P-8DS HNC2-2.5P-8DSL HNC2-2.5S-10 HNC2-2.5S-15 HNC2-2.5S-2 HNC2-2.5S-3 HNC2-2.5S-4 HNC2-2.5S-5 HNC2-2.5S-6 HNC2-2.5S-7 HNC2-2.5S-8 HNC1-2.5S-12 HNC1-2.5P-12DS HNC-2.5S-C-A HNC-2.5S-C-B HNC-2.5S-D-A HNC-2.5S-D-B HIROSEELECTRICUSAINC.-HNC2-2.5S-7
Description 2.5mm Pitch Connector for Discrete Wire Connection 2.5毫米间距连接线连接离
RESISTOR 2.4 OHM .5W CARB COMP 2.5毫米间距连接线连接离
Inductor; Series:IHLP-2525CZ; Inductance:4.7uH; Inductance Tolerance: /- 20 %; Terminal Type:PCB Surface Mount; Current Rating:5.5A; Leaded Process Compatible:Yes; Mounting Type:Surface Mount; packaging:tape And Reel 2.5毫米间距连接线连接离
Inductor; Series:IHLP-2525CZ; Inductance:3.3uH; Inductance Tolerance: /- 20 %; Terminal Type:PCB Surface Mount; Current Rating:6A; Leaded Process Compatible:Yes; Mounting Type:Surface Mount; packaging:Cut tape
INDUCTOR 2525CZ 0.47 UH 20% LOW PROFILE high CURRENT
Inductor; Inductor Type:high Frequency; Inductance:2.2uH; Inductance Tolerance: 20 %; Current Rating:8A; Series:IHLP-2525CZ; Package/Case:PCB Surface Mount; Leaded Process Compatible:Yes; Mounting Type:Surface Mount RoHS Compliant: Yes

File Size 206.40K  /  7 Page

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    DC Components Co., Ltd.
Part No. KBH4
Description Tantalum Molded Capacitor; Capacitance: 10uF; Voltage: 25V; Case Size: 5.8x3.1 mm; packaging: tape & Reel

File Size 353.77K  /  2 Page

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    V23833-G6005-A101

Infineon Technologies AG
Part No. V23833-G6005-A101
Description Tantalum Molded Capacitor; Capacitance: 1uF; Voltage: 35V; Case Size: 3.2x1.6 mm; packaging: tape & Reel

File Size 643.77K  /  27 Page

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    P4631-10 G6122 G6122-03 P4639 G6126 P4631 P4631-01 P4631-03 P4631-04 P4638

Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
Part No. P4631-10 G6122 G6122-03 P4639 G6126 P4631 P4631-01 P4631-03 P4631-04 P4638
Description Tantalum Molded Capacitor; Capacitance: 150uF; Voltage: 4V; packaging: tape & Reel
Infrared detector module with preamp

File Size 115.26K  /  4 Page

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    KA7305

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. KA7305
Description Tantalum Conformal-Coated Capacitor; Capacitance: 3.3uF; Voltage: 16V; packaging: tape & Reel
B/W CCD PROCESSOR

File Size 123.07K  /  9 Page

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    Electronic Theatre Controls, Inc.
Part No. X24C04V-1.8 X24C04PI-1.8 X24C04V-2.7 X24C04MI-1.8 X24C04S14M-3.5C7000 X24C04S8I-1.8 X24C04S8-1.8 X24C04S8I-3.5C7000
Description 30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF3709ZCS with Standard packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRL3713L with Standard packaging
I2C Serial EEPROM
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRFZ46NS with tape and Reel Right packaging
30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRLR3303 with Standard packaging I2C串行EEPROM

File Size 434.20K  /  16 Page

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    Nichicon, Corp.
Part No. UUX1C221MNL1GS
Description Aluminum Electrolytic SMT high Capacitance Range Capacitor; Capacitance: 220uF; Voltage: 16V; Case Size: 10x10 mm; packaging: tape & Reel CAPACITOR, ALUMINUM ELECTROLYTIC, NON SOLID, POLARIZED, 16 V, 220 uF, SURFACE MOUNT

File Size 45.14K  /  2 Page

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For tape packaging for high volume Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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Price & Availability of tape packaging for high volume

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