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  heatsink d-pak3 tin plated smd Datasheet PDF File

For heatsink d-pak3 tin plated smd Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    DO1 DO2 DO3

HB Electronic Components
Part No. DO1 DO2 DO3
Description heatsink DOx

File Size 59.69K  /  1 Page

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Part No. 4473 4525
Description heatsink CLIP

File Size 67.49K  /  1 Page

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    CLP-204

Aavid Thermalloy, LLC
Part No. CLP-204
Description heatsink CLIP

File Size 26.45K  /  1 Page

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    Advanced Power Electron...
Part No. AP92U03GMT-HF-16
Description SO-8 Compatible with heatsink

File Size 48.55K  /  5 Page

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    Mitsubishi Electric Corporation
Mitsubishi Electric, Corp.
Part No. M30240S7-XXXFP M30240M1 M30240MA M30240M3 M30240M2 M30240M5 M30240M4 M30240M5-XXXFP M30240M9-XXXFP M30240M3-XXXFP M30240M2-XXXFP M30240S1-XXXFP M30240F1-XXXFP M30240S6-XXXFP M30240S2-XXXFP M30240S8-XXXFP M30240F4-XXXFP M30240FA-XXXFP M30240FC-XXXFP M30240F7-XXXFP M30240F9-XXXFP M30240F8-XXXFP M30240F2-XXXFP M30240F5-XXXFP M30240F3-XXXFP M30240E5-XXXFP M30240E7-XXXFP M30240E3-XXXFP M30240S3-XXXFP M30240M8-XXXFP M30240E1
Description 16 Characters x 2 Lines, 5x7 Dot Matrix Character and Cursor
SSR H/S ZS CURR SENSE 4-32VDC 50A 600V OTP NPN NO
CAP 3.9PF 50V .10 PF CER-U smd-0402 TR-7 plated-NI/SN LOWESR
FLEX CONNECTOR, 20 POSN., SMT, VERTICAL, ZIF, W/STANDARD SLIDER, T&R RoHS Compliant: Yes
CAP 1800PF 50V 10% X7R smd-0402 TR-7 plated-NI/SN
CAP 820PF 50V 5% X7R smd-0402 TR-7 plated-NI/SN
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 单片16位CMOS微机
SSR H/S ZS CURR SENSE 4-32VDC 50A 600V OTP PNP NO 单片16位CMOS微机

File Size 927.67K  /  142 Page

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    SEMIKRON[Semikron International]
Part No. K5-M8 K5
Description heatsink For stud devices

File Size 338.79K  /  3 Page

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    SEMIKRON[Semikron International]
Part No. P5A_100 P5A P5A/100
Description heatsink - For bridge modules

File Size 198.41K  /  3 Page

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    SEMIKRON[Semikron International]
Part No. P8_375 P8 P8_180 P8/375
Description heatsink For capsule devices

File Size 1,041.88K  /  4 Page

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    SEMIKRON[Semikron International]
Part No. P9_430 2XP9_210 P9 2XP9/210
Description heatsink For capsule devices

File Size 628.60K  /  3 Page

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    SGS Thomson Microelectronics
Part No. AN646
Description heatsink CALCULATION AND EXAMPLES

File Size 32.09K  /  3 Page

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For heatsink d-pak3 tin plated smd Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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