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Infineon
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| Part No. |
HYB18T256400AC-3.7 HYB18T256400AC-5 HYB18T256160AC-3.7 HYB18T256160AC-5 HYB18T256800AC-3.7 HYB18T256800AC-5
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| OCR Text |
...either 16Mbit x 4 I/O x 4 bank, 8mbit x 8 I/O x 4 bank or 4mbit x 16 I/O x 4 bank device. These synchronous devices achieve high speed double-data-rate transfer rates of up to 667 Mb/sec/pin for general applications. The chip is designed to... |
| Description |
DDR2 SDRAM Components - 256Mb (64Mx4) DDR2 533 (4-4-4) Available 3Q04
DDR2 SDRAM Components - 256Mb (64Mx4) DDR2 400 (3-3-3) Available 3Q04
DDR2 SDRAM Components - 256Mb (16Mx16) DDR2 533 (4-4-4) Available 3Q04
DDR2 SDRAM Components - 256Mb (16Mx16) DDR2 400 (3-3-3) Available 3Q04
DDR2 SDRAM Components - 256Mb (32Mx8) DDR2 533 (4-4-4) Available 3Q04
DDR2 SDRAM Components - 256Mb (32Mx8) DDR2 400 (3-3-3) Available 3Q04
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| File Size |
1,220.41K /
91 Page |
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Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
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| Part No. |
K4H560838F-TC/LA2 K4H560838F-TC/LB3 K4H561638F-TC/LA2 K4H560838F-TC/LAA K4H561638F-TC/LAA K4H560838F-TC/LB0 K4H561638F-TC/LB0 K4H561638F-TC/LB3
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| OCR Text |
...dqi data strobe block diagram ( 8mbit x 8 / 4mbit x 16 i/o x 4 banks) l(u)dm l(u)dm dm input register
ddr sdram ddr sdram 256mb f-die (x8, x16) rev. 1.3 october, 2004 symbol type description ck, ck input clock : ck and ck are different... |
| Description |
256Mb F-die DDR SDRAM Specification 256Mb的的F - DDR SDRAM内存芯片规格
10-Bit, 38 kSPS ADC Serial Out, On-Chip System Clock, Single Ch. 8-PDIP
10-Bit, 38 kSPS ADC Serial Out, On-Chip System Clock, 11 Ch. 20-PLCC -40 to 125
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| File Size |
331.11K /
23 Page |
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Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
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| Part No. |
K4H560838D-TC/LB0 K4H560838D-TC/LA2 K4H560838D-TC/LB3 K4H560838D-TC/LA0 K4H561638D-TC/LA0 K4H561638D-TC/LB0 K4H560438D-TC/LB0 K4H560438D-TC/LA2 K4H560438D-TCB3 K4H561638D-TC/LB3 K4H561638D-TC/LA2 K4H560438D-TC/LB3 K4H560438D-TC/LA0
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| OCR Text |
... dqi data strobe block diagram (8mbit x 8 i/o x 4 banks)
- 5 - 256mb ddr sdram rev. 0.4 may. 2002 bank select timing register a d d r...4mbit x 16 i/o x 4 banks)
- 6 - 256mb ddr sdram rev. 0.4 may. 2002 input/output function desc... |
| Description |
64M X 4 DDR DRAM, 0.7 ns, PDSO66
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 20-HTSSOP -40 to 125 256Mb
10-Bit, 38 kSPS ADC Serial Out, On-Chip System Clock, 11 Ch. 20-PDIP 256Mb
10-Bit, 38 kSPS ADC Serial Out, On-Chip System Clock, 11 Ch. 20-PLCC 256Mb
10-Bit, 400 kSPS ADC Serial Out, SPI/DSP Compatible I/F, Power Down, 8 Ch. 20-SOIC -40 to 85
10-Bit, 400 kSPS ADC Serial Out, SPI/DSP Compatible I/F, Power Down, 8 Ch. 20-TSSOP -40 to 85
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| File Size |
239.34K /
25 Page |
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Atmel, Corp.
SAMSUNG SEMICONDUCTOR CO. LTD.
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| Part No. |
K4H560838H-UC/LCC K4H561638H-UC/LCC K4H560438H-UC/LA2 K4H560838H-UC/LA2 K4H561638H-UC/LA2 K4H560438H-UC/LB0 K4H561638H-UC/LB0 K4H560838H-UC/LB3 K4H561638H-UC/LB3 K4H560838H-UC/LB0 K4H560438H-UCA20 K4H560838H-UCA20 K4H560838H-UCB30
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| OCR Text |
... 6.0 Block Diagram (16Mbit x4 / 8mbit x8 / 4mbit x16 I/O x4 Banks).............................................. 7 7.0 Input/Output Function Description .......................................................................................... |
| Description |
32M X 8 DDR DRAM, 0.7 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
32M X 8 DDR DRAM, 0.75 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
64M X 4 DDR DRAM, 0.75 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
256Mb H-die DDR SDRAM Specification
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| File Size |
361.04K /
24 Page |
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