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Amphenol Communications Solutions |
| Part No. |
10132450-0611GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-812262450LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-124506LF
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| Description |
BERGSTAK 0.8MM
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87759-4664
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-
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| File Size |
421.17K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
66245-020LF
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| Description |
Quickie® IDC Cable-to-Board Connector System, Backplane - Double row - 20 Positions - 2.54 mm (0.100in) .
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87759-4665
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
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| File Size |
280.47K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68482-450HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-812102450LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-1821GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-1411GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-0221GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-124502LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 120 Positions.
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Official Product Page
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Bom2Buy.com
Price and Availability
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