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Molex Electronics Ltd.
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| Part No. |
15-80-0107 0015800107 A-70567-0207
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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| File Size |
1,218.53K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10125112-080012CLF
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| Description |
HPCE BTB R/A Receptacle 8P12S WITH GUIDE
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10125023-080012ALF
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| Description |
HPCE BTB VT RECEPT 8P12S
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0105 0015800105 A-70567-0139
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat Molex Electronics Ltd.
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10072353-G01-25ULF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 50 Positions - 2mm (0.079inch) - Right Angle
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800181 70567-0007 A-70567-0007 15-80-0181
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating MOLEX Connector
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10075024-F01-25ULF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 50 Positions - 2mm (0.079inch) - Vertical
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0101 70567-0003 A-70567-0003 0015800101
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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| File Size |
1,218.41K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10112684-F01-25ULF
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| Description |
Unshrouded Right Angle Headers - Surface Mount - Single row - 25 Positions - 2.00mm (0.079in)
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10112690-F01-25ULF
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| Description |
Header, Surface Mount, Double row, 50, 2mm (0.079in), Right Angle
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10125025-002LF
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| Description |
HPCE VT Receptacle 20P Omit 4P
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70567-0010 A-70567-0010 0015800241
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
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| File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54122-109201250LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70567-0011 A-70567-0011 0015800261
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10125837-001SPGLF
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| Description |
10125837-001SPGLF-SMALL MOQ VERSION
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800169 15-80-0169 A-70567-0278
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10125138-080400BLF
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| Description |
HPCE STD VT Receptacle 12P
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| Tech specs |
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Official Product Page
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