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BR0665 LN122DF T2300 3N60C 3N60C WM0831IP 70280 10310
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  52418-0910 Datasheet PDF File

For 52418-0910 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    ALN0910

Advanced Semiconductor Business Inc.
Part No. ALN0910
Description Internally Matched LNA Module

File Size 409.44K  /  3 Page

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Amphenol Communications Solutions

Part No. 10069524-182402LF
Description Bergstak® 0.80mm Pitch, Board to Board Receptacle, Vertical, Double Row, 180 Positions, 0.80mm (0.031in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    EIM0910-4

Excelics Semiconductor, Inc.
Part No. EIM0910-4
Description 9.5-10.5GHz Multi-Stage Power Amplifier

File Size 135.88K  /  3 Page

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Amphenol Communications Solutions

Part No. 87052-418HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    Integrated Technology F...
Part No. 250910B
Description SAW Bandpass Filter

File Size 210.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 10106132-4009101LF
Description PwrBlade+® , Power Connectors, 4HDP+36S STB, Right Angle, Header.
Tech specs    

Official Product Page

    TIM0910-5

Toshiba Semiconductor
Part No. TIM0910-5
Description MICROWAVE SEMICONDUCTOR TECHNICAL DATA

File Size 366.93K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109101700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    TGI0910-50

Toshiba Semiconductor
Part No. TGI0910-50
Description MICROWAVE POWER GaN HEMT

File Size 131.89K  /  2 Page

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Amphenol Communications Solutions

Part No. 10082091-001LF
Description HCI® Connector System, Power Supply Connectors, 11DC+24S Right Angle Header.
Tech specs    

Official Product Page

    TIM0910-4

Toshiba Semiconductor
Part No. TIM0910-4
Description MICROWAVE POWER GaAs FET

File Size 168.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 10129380-910001BLF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Advanced Semiconductor ...
Part No. ALN0910-13
Description Internally Matched LNA Module

File Size 557.48K  /  3 Page

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Amphenol Communications Solutions

Part No. 10060910-001LF
Description GIG-Array®, Mezzanine Connectors, 13mm Plug 200 Position Lead Free.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM0910-10
Description MICROWAVE POWER GaAs FET

File Size 112.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 10106133-4009101LF
Description PwrBlade+® , Power Connectors, 4HDP+36S PF, Right Angle, Header.
Tech specs    

Official Product Page

    FLM0910-3F

Eudyna Devices Inc
Part No. FLM0910-3F
Description X, Ku-Band Internally Matched FET

File Size 306.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 95609-108LF
Description Minitek® 2.00mm, Wire To Board, Shrouded Headers, Through Hole, Right Angle, Double Row, 8 Positions
Tech specs    

Official Product Page

    260910B

Integrated Technology Future
Part No. 260910B
Description 221.5 MHz SAW Filter

File Size 160.10K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-109101400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 52418-0910 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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