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  1140-4205 Datasheet PDF File

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    11-40-2091 1140-2091 0011-40-2091

Molex Electronics Ltd.
Part No. 11-40-2091 1140-2091 0011-40-2091
Description Terminator Die
File Size 19.43K  /  1 Page

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Amphenol Communications Solutions
Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    1140-4009 0011-40-4009

Molex Electronics Ltd.
Part No. 1140-4009 0011-40-4009
Description Insulation Punch
File Size 14.47K  /  1 Page

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Amphenol Communications Solutions
Part No. 54242-110042050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    11-40-2043 1140-2043 0011-40-2043

Molex Electronics Ltd.
Part No. 11-40-2043 1140-2043 0011-40-2043
Description Terminator Die
File Size 19.42K  /  1 Page

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Amphenol Communications Solutions
Part No. 72814-205LF
Description Sofix ® - Right Angle Header Power Assembly
Tech specs 　 　

Official Product Page

    11-40-2036 1140-2036 0011-40-2036

Molex Electronics Ltd.
Part No. 11-40-2036 1140-2036 0011-40-2036
Description Terminator Die
File Size 19.42K  /  1 Page

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Amphenol Communications Solutions
Part No. 77315-G42-05LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    1140-4015 0011-40-4015

Molex Electronics Ltd.
Part No. 1140-4015 0011-40-4015
Description Insulation Punch
File Size 14.53K  /  1 Page

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Amphenol Communications Solutions
Part No. 10080054-205LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    11-40-2076 1140-2076 0011-40-2076

Molex Electronics Ltd.
Part No. 11-40-2076 1140-2076 0011-40-2076
Description Terminator Die
File Size 19.42K  /  1 Page

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Amphenol Communications Solutions
Part No. 10142634-205KLF
Description Minitek MicroSpace™ 1.50mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 5 Position,Staggered,side Latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs 　 　

Official Product Page

    11-40-2066 1140-2066 0011-40-2066

Molex Electronics Ltd.
Part No. 11-40-2066 1140-2066 0011-40-2066
Description Terminator Die - DOUBLES
File Size 19.46K  /  1 Page

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Amphenol Communications Solutions
Part No. 54111-110042050LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    11-40-2045 1140-2045 0011-40-2045

Molex Electronics Ltd.
Part No. 11-40-2045 1140-2045 0011-40-2045
Description Terminator Die - OVERLAP INSULATION CRIMP
File Size 19.49K  /  1 Page

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Amphenol Communications Solutions
Part No. 68604-205HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    11-40-2064 1140-2064 0011-40-2064

Molex Electronics Ltd.
Part No. 11-40-2064 1140-2064 0011-40-2064
Description Terminator Die
File Size 19.42K  /  1 Page

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Amphenol Communications Solutions
Part No. 78554-205HLF
Description 78554-205HLF-B/S II
Tech specs 　 　

Official Product Page

    1140-4017 0011-40-4017

Molex Electronics Ltd.
Part No. 1140-4017 0011-40-4017
Description Insulation Punch
File Size 14.44K  /  1 Page

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Amphenol Communications Solutions
Part No. 54242-109042050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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