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wire-in-air Datasheet PDF File

For wire-in-air Found Datasheets File :: 7637 Search Time::2.781ms
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				MOTOROLA INC Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX2700A MPX2700AP MPX2700ASX
OCR Text	...> P2 MAX SPAN RANGE (TYP) WIRE BOND PSI kPa 20 140 40 280 60 420 80 560 100 700 Figure 3. Output versus Pressure ...in Its Basic Package (Not to Scale) Figure 4 shows the cross section of the Motorola MPX pressure...
Description	ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 1%, 0-40mV, ROUND, THROUGH HOLE MOUNT X-ducer SILICON PRESSURE SENSORS
File Size	164.50K / 6 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX2700 MPX2700D MPX2700DP MPX2700GP MPX2700GS MPX2700GSX MPX2700GVP MPX2700GVS MPX2700GVSX
OCR Text	...ICONE DIE COAT SPAN RANGE (TYP) WIRE BOND DIE P1 STAINLESS STEEL METAL COVER PSI kPa 20 140 40 280 60 420 80 560 100...in Its Basic Package (Not to Scale) Figure 4 shows the cross section of the Motorola MPX pressure...
Description	0 to 700 kPa (0 to 100 psi) 40 mV FULL SCALE SPAN (TYPICAL) GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 0.5%, 0-40mV, ROUND, THROUGH HOLE MOUNT
File Size	187.83K / 10 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MPX4200 MPX4200A MPX4200AP MPX4200AS MPX4200ASX
OCR Text	...X4200 SERIES SILICONE DIE COAT WIRE BOND STAINLESS STEEL METAL COVER P1 EPOXY CASE DIE MPX4200A OUPUT (PIN 1) 50 pF 51 k A/D LE...in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds f...
Description	INTEGRATED PRESSURE SENSOR 20 to 200 kPa (2.9 to 29 psi) 0.3 to 4.9 V OUTPUT
File Size	140.29K / 8 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX4250D MPX4250DP MPX4250GS MPX4250GSX
OCR Text	...S FLUORO SILICONE DIE COAT DIE WIRE BOND P1 STAINLESS STEEL METAL COVER MPX4250D OUPUT (PIN 1) 50 pF 51 k A/D LEAD FRAME Figure 2 illustrates the Differential/Gauge Pressure Sensing Chip in the basic chip carrier (Case 867). A fluoro...
Description	OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 250 kPa (0 to 36.3 psi) 0.2 to 4.91 Volts Output 经营概况集成压力传感250 kPa36.3 PSI）的0.2.91伏特输出 OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 250 kPa (0 to 36.3 psi) 0.2 to 4.91 Volts Output GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-36.25Psi, 1.4%, 0.20-4.90V, ROUND, THROUGH HOLE MOUNT
File Size	145.33K / 8 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX4250 MPX4250A MPX4250AP MPX4250AS MPX4250ASX
OCR Text	...X4250 SERIES SILICONE DIE COAT WIRE BOND STAINLESS STEEL METAL COVER P1 EPOXY CASE DIE MPX4250A OUPUT (PIN 1) 50 pF 51 k A/D LE...in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds f...
Description	INTEGRATED PRESSURE SENSOR 20 to 250 kPa (2.9 to 36.3 psi) 0.2 to 4.9 V OUTPUT ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-36.25Psi, 1.5%, 4.62-4.76V, ROUND, THROUGH HOLE MOUNT
File Size	142.92K / 8 Page	View it Online	Download Datasheet

				Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX5050 MPX5050D MPX5050DP MPX5050GP MPX5050GS MPX5050GSX MPX5050GVP MPX5050GVS MPX5050GVSX
OCR Text	...el isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphrag...in your application. Figure 4 shows a typical decoupling circuit for interfacing the integrated sens...
Description	OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output
File Size	186.91K / 10 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MPX5100 MPX5100A MPX5100AP MPX5100D MPX5100DP MPX5100GP MPX5100GSX MPXV5100GC7U MPXV5100 MPXV5100GC6U
OCR Text	...el isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphrag...in your application. Figure 4 shows the recommended decoupling circuit for interfacing the output of...
Description	MPX5100 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	394.62K / 12 Page	View it Online	Download Datasheet

				Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX7100 MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D MPX7100DP MPX7100GP MPX7100GS MPX7100GSX MPX7100GVP MPX7100GVS MPX7100GVSX
OCR Text	...ential SILICONE GEL DIE COAT WIRE BOND WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME Figure 4....in the basic chip carrier (Case 344-15). A silicone gel isolates the die surface and wire bonds from...
Description	0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
File Size	190.50K / 10 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MPXC2011DT1 MPXC2012DT1
OCR Text	...ure Switching NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when ha...
Description	High Volume Sensor for Low Pressure Applications
File Size	93.21K / 4 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MPXT2010 MPXT2010G7U
OCR Text	...el isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphra...in their designs. air may have adverse effects on sensor performance and long term reliability. C...
Description	COMPENSATED PRESSURE SENSOR
File Size	89.39K / 4 Page	View it Online	Download Datasheet

For wire-in-air Found Datasheets File :: 7637 Search Time::2.781ms
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