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For wire-bond Found Datasheets File :: 3390 Search Time::6ms
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				International Rectifier
Part No.	IR2151
OCR Text	...ethod of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Mater...
Description	SELF-OSCILLATING HALF-BRIDGE DRIVER
File Size	193.98K / 6 Page	View it Online	Download Datasheet

				AD[Analog Devices]
Part No.	AD96685 AD96685BH AD96685BP AD96685BP-REEL AD96685BQ AD96685BR AD96685TQ AD96687 AD96687BP AD96687BQ AD96687BR AD96687BR-REEL AD96687TQ
OCR Text	... . . . . . . Gold Eutectic Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding or 1 mil, Gold, Gold Ball Bonding Die Dimensions (AD96687) . . . . . . . . 77 60 15 ( 2) mils Pad Dimensions . . . . . . . . . . . . . . . . . . ...
Description	Ultrafast Comparators
File Size	121.42K / 6 Page	View it Online	Download Datasheet

				ADVANCED MICRO DEVICES INC PROM Advanced Micro Devices, Inc. AMD[Advanced Micro Devices]
Part No.	AM29F010-1 AM29F010-120DGC1 AM29F010-120DGE1 AM29F010-120DGI1 AM29F010-120DPC1 AM29F010-120DPE1 AM29F010-120DPI1 AM29F010-120DTC1 AM29F010-120DTE1 AM29F010-120DTI1 AM29F010-120DWC1 AM29F010-120DWE1 AM29F010-120DWI1 AM29F010-9 AM29F010-90DGC1 AM29F010-90DWI1 AM29F010-90DGE1 AM29F010-90DGI1 AM29F010-90DPC1 AM29F010-90DPE1 AM29F010-90DPI1 AM29F010-90DTC1 AM29F010-90DTE1 AM29F010-90DTI1 AM29F010-90DWC1 AM29F010-90DWE1 AM29F010B-90DTC1 AM29F010-120DTI AM29F010B-90DTI1 AM29F010B-90DPI1 AM29F010-120DTC AM29F010B-90DPC1 AM29F010-120DPC AM29F010B-90DTE1 AM29F010B-90DGI1
OCR Text	...ad 1 and can be used to operate wire bonding equipment. 4 Am29F010 Known Good Die 1/13/98 SUPPLEMENT ORDERING INFORMATION Sta...Bond Pad Size . . . . . . . . . . . . . . 4.47 mils x 4.47 mils 113.48 m x 113.48 m Pad Area Free of...
Description	1 megabit CMOS 5.0 volt-only, uniform sector flash memory- die revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash MemoryDie Revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1 128K X 8 FLASH 5V PROM, 120 ns, UUC30 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-Die Revision 1 128K X 8 FLASH 5V PROM, 90 ns, UUC30 Evaluation Board for LM3202 650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers 128K X 8 FLASH 5V PROM, 90 ns, UUC30 LM3202 650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers; Package: MICRO SMD; No of Pins: 8 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only Uniform Sector Flash Memory-Die Revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only/ Uniform Sector Flash Memory-Die Revision 1
File Size	55.30K / 8 Page	View it Online	Download Datasheet

				http:// AMD[Advanced Micro Devices] Advanced Micro Devices, Inc. ADVANCED MICRO DEVICES INC
Part No.	AM29F800 AM29F800B-1 AM29F800BB-120DGC AM29F800BB-120DGC1 AM29F800BB-120DGE AM29F800BB-120DGE1 AM29F800BB-120DGI AM29F800BB-120DGI1 AM29F800BB-120DPC AM29F800BB-120DPC1 AM29F800BB-120DPE AM29F800BB-120DPE1 AM29F800BB-120DPI AM29F800BB-120DPI1 AM29F800BB-120DTC AM29F800BB-120DTC1 AM29F800BB-120DTE AM29F800BB-120DTE1 AM29F800BB-120DTI AM29F800BB-120DTI1 AM29F800BB-120DWC AM29F800BB-120DWC1 AM29F800BB-120DWE AM29F800BB-120DWE1 AM29F800BB-120DWI AM29F800BB-120DWI1 AM29F800BB-90DGC AM29F800BT AM29F800BT-120DGC AM29F800BT-120DGC1 AM29F800BT-120DGE AM29F800BT-120DGE1 AM29F800BT-120DGI AM29F800BT-120DGI1 AM29F800BT-120DPC AM29F800BT-120DPC1 AM29F800BT-120DPE AM29F800BT-120DPE1 AM29F800BT-120DPI AM29F800BT-120DPI1 AM29F800BT-120DTC AM29F800BT-120DTC1 AM29F800BT-120DTE AM29F800BT-120DTE1 AM29F800BT-120DTI AM29F800BT-120DTI1 AM29F800BT-120DWC AM29F800BT-120DWC1 AM29F800BT-120DWE AM29F800BT-120DWE1 AM29F800BT-120DWI AM29F800BT-120DWI1 AM29F800BT-90DWI1 29F800 AM29F800BB-90DGC1 AM29F800BB-90DGE AM29F800BB-90DGE1 AM29F800BB-90DGI AM29F800BB-90DGI1 AM29F800BB-90DPC AM29F800BB-90DPC1 AM29F800BB-90DPE AM29F800BB-90DPE1 AM29F800BB-90DPI AM29F800BB-90DPI1 AM29F800BB-90DTC AM29F800BB-90DTC1 AM29F800BB
OCR Text	...ad 1 and can be used to operate wire bonding equipment. 4 Am29F800B Known Good Die 5/4/98 SUPPLEMENT ORDERING INFORMATION Sta...Bond Pad Size . . . . . . . . . . . . . . 3.94 mils x 3.94 mils . . . . . . . . . . . . . . . . . . ...
Description	8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only Boot Sector Flash Memory-Die Revision 1 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only / Boot Sector Flash Memory-Die Revision 1 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only/ Boot Sector Flash Memory-Die Revision 1 LED Lamp; Bulb Size:T-1; LED Color:Green; Luminous Intensity:110ucd; Viewing Angle:36 ; Forward Current:20mA; Forward Voltage:2.2V; Operating Temperature Range:-25 C to 85 C; Color:Green; Leaded Process Compatible:Yes RoHS Compliant: Yes LED Lamp; Bulb Size:T-1; LED Color:Red; Luminous Intensity:630ucd; Viewing Angle:10 ; Forward Current:20mA; Forward Voltage:2V; Operating Temperature Range:-25 C to 85 C; Color:Red; Leaded Process Compatible:Yes RoHS Compliant: Yes LED Lamp; Bulb Size:T-1 3/4; LED Color:Green; Luminous Intensity:780ucd; Viewing Angle:20 ; Forward Current:20mA; Forward Voltage:2.2V; Operating Temperature Range:-25 C to 85 C; Color:Green; Leaded Process Compatible:Yes RoHS Compliant: Yes LED Lamp; Bulb Size:T-1 3/4; LED Color:Blue/Green; Luminous Intensity:2200mcd; Viewing Angle:12 ; Forward Current:20mA; Forward Voltage:3.5V; Operating Temperature Range:-40 C to 85 C; Leaded Process Compatible:Yes RoHS Compliant: Yes LED Lamp; Bulb Size:T-1 3/4; LED Color:Green; Luminous Intensity:5000ucd; Viewing Angle:20 ; Forward Current:20mA; Forward Voltage:3.5V; Operating Temperature Range:-40 C to 85 C; Color:Green; Leaded Process Compatible:Yes RoHS Compliant: Yes RES 31.6 OHM 1/8W 1% 0805 SMD LED Lamp; LED Color:Blue; Luminous Intensity:50mcd; Viewing Angle:140 ; Forward Current:20mA; Forward Voltage:3.5V; Operating Temperature Range:-40 C to 80 C; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes LED Lamp; LED Color:Orange; Luminous Intensity:60mcd; Viewing Angle:140 ; Forward Current:20mA; Forward Voltage:2V; Operating Temperature Range:-30 C to 85 C; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes LED Lamp; Bulb Size:1.8mm; LED Color:Red; Luminous Intensity:480ucd; Viewing Angle:30 ; Forward Current:20mA; Forward Voltage:1.7V; Operating Temperature Range:-40 C to 85 C; Color:Red; Leaded Process Compatible:Yes RoHS Compliant: Yes Dual Retriggerable Monostable Multivibrators 16-TSSOP -40 to 85 LED Lamp; Bulb Size:1.8mm; LED Color:Blue; Luminous Intensity:112mcd; Viewing Angle:30 ; Forward Current:20mA; Forward Voltage:3.8V; Operating Temperature Range:-30 C to 85 C; Leaded Process Compatible:Yes RoHS Compliant: Yes Am29F800B KGD (Known Good Die) Supplement ESD-Safe Illuminated Binocular Microscope; RoHS Compliant: Yes 1M X 8 FLASH 5V PROM, 90 ns, UUC44
File Size	151.53K / 9 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IR2131
OCR Text	...ethod of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Mater...
Description	3 HIGH SIDE AND 3 LOW SIDE DRIVER
File Size	248.96K / 8 Page	View it Online	Download Datasheet

				Honeywell International, Inc. MACOM[Tyco Electronics] MA-Com
Part No.	MA4M1200 MA4M1300 MA4M3030 MA4M2020 MA4M2300 MA4M1600 MA4M3150 MA4M MA4M1010 MA4M1020 MA4M1030 MA4M1050 MA4M1080 MA4M1100 MA4M1250 MA4M2002 MA4M2005 MA4M2100 MA4M3010 MA4M3020 MA4M3050 MA4M3100
OCR Text	...nic, TC or pulse bonding of the wire or ribbon leads are all acceptable methods. Temperature for the pulse bonder should not exceed 300C. Ma...bond strength that exceeds MIL-STD-883B Method 2011.2 for gold wire or gold ribbon. Solder Solde...
Description	MNS Microwave Chip Capacitors 硫化锰微波贴片电 100 V, MNS microwave chip capacitor 250 V, MNS microwave chip capacitor 200 V, MNS microwave chip capacitor
File Size	40.32K / 4 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	MSA-0400
OCR Text	...ball bonding using 0.7 mil gold wire. See APPLICATIONS section, "Chip Use". Chip Outline[1] Description The MSA-0400 is a high perfor...Bond Pads are 41 m / 1.6 mil typical on each side. Note 1: Output contact is made by die attaching t...
Description	Cascadable Silicon Bipolar MMIC Amplifier
File Size	49.94K / 4 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	MSA-0800 MSA-0800-GP4
OCR Text	...ball bonding using 0.7 mil gold wire.[1] See APPLICATIONS section, "Chip Use". Chip Outline[1] Note: 1. Refer to the APPLICATIONS sect...Bond Pads are 41 m/1.6 mil typical on each side. Note 1: Output contact is made by die attaching the...
Description	Cascadable Silicon Bipolar MMIC Amplifier
File Size	70.16K / 4 Page	View it Online	Download Datasheet

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