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  molding type module Datasheet PDF File

For molding type module Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0479510001

Molex Electronics Ltd.
Part No. 0479510001
Description MOBILE TV ANTENNA AFTER molding

File Size 257.02K  /  3 Page

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    MHCI04012-R22M-R8 MHCI04012-R47M-R8 MHCI04012-1R0M-R8 MHCI04012-R68M-R8 MHCI04015-1R5M-R8 MHCI04015-3R3M-R8

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Part No. MHCI04012-R22M-R8 MHCI04012-R47M-R8 MHCI04012-1R0M-R8 MHCI04012-R68M-R8 MHCI04015-1R5M-R8 MHCI04015-3R3M-R8
Description molding Power Choke

File Size 674.27K  /  23 Page

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    MHCB06030-3R3M-C1 MHCB06030-1R5M-C1 MHCB06030-6R8M-C1 MHCB06030-R82M-C1 MHCB06030-1R0M-C1 MHCB06030-R68M-C1 MHCB06030-4R

List of Unclassifed Manufacturers
List of Unclassifed Man...
Part No. MHCB06030-3R3M-C1 MHCB06030-1R5M-C1 MHCB06030-6R8M-C1 MHCB06030-R82M-C1 MHCB06030-1R0M-C1 MHCB06030-R68M-C1 MHCB06030-4R7M-C1 MHCB06030-R10M-C1 MHCB06030-2R2M-C1
Description molding Power Choke

File Size 257.32K  /  3 Page

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    Chilisin
Part No. MHSC04020-R33M-R8 MHSC04020-R47M-R8
Description molding Power Choke

File Size 407.88K  /  6 Page

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    DKR300AB60

SanRex Corporation
Part No. DKR300AB60
Description FAST RECOVERY DIODES
From old datasheet system
DIODE module(NON-ISOLATED type
DIODE module(NON-ISOLATED type?/a>

File Size 90.67K  /  2 Page

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    PS21342-N

Mitsubishi Electric Corporation
Mitsubishi Electric Semiconductor
Powerex Power Semiconductors
Part No. PS21342-N
Description DIP - IPM
MITSUBISHI SEMICONDUCTOR Power module TRANSFER-MOLD type INSULATED type
MITSUBISHI SEMICONDUCTOR module> TRANSFER-MOLD type INSULATED type
Intelligent Power module TRANSFER-MOLD type INSULATED type

File Size 170.78K  /  9 Page

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    SIEMENS A G
DRAM
SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYS72V8200GU HYS64V8200GU HYS72V16220GU HYS64V16220GU PC100_2 HYS64-74V8200GU PC66-222-920 HYS64V16220GU-10 HYS64V16220GU-8 HYS64V16220GU-8B HYS64V8200GU-10 HYS64V8200GU-8 HYS64V8200GU-8B HYS72V16220GU-10 HYS72V16220GU-8 HYS72V8200GU-10 HYS72V8200GU-8 PC100-222-620 PC100-323-620
Description 3.3 V 8M x 64/72-Bit 1 Bank SDRAM module 3.3 V 16M x 64/72-Bit 2 Bank SDRAM module 3.38米64/72-Bit一银行内存模块3.36米x 64/72-Bit 2银行内存模块
3.3 V 8M x 64/72-Bit 1 Bank SDRAM module 3.3 V 16M x 64/72-Bit 2 Bank SDRAM module 8M X 64 SYNCHRONOUS DRAM module, 8 ns, DMA168
Network Cable Assembly; Connector type A:T568A/B Modular Plug; Connector type B:T568A/B Modular Plug; Cable Length:10ft; Approval Categories:Augmented Category 6 standards; cord color per TIA/EIA-606 standard RoHS Compliant: Yes
From old datasheet system

File Size 83.22K  /  17 Page

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    http://
AGERE[Agere Systems]
Part No. A371-20BS A371-20GS A371 A371-24NS A371-20AS A371-20FS A371-20NS A371-22AD A371-22BD A371-22GD A371-22ND A371-24AS A371-24BS A371-24FS A371-24GS A371-type A371-22FD
Description A371-type Analog Uncooled Isolated DFB FastLight ?Laser module
A371-type Analog Uncooled Isolated DFB FastLight Laser module
A371-type Analog Uncooled Isolated DFB FastLight ⑩ Laser module
Circular Connector; No. of Contacts:4; Series:; Body Material:Aluminum Alloy; Connecting Termination:Crimp; Connector Shell Size:8; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:8-4
KPT 12C 8#20 4#16 PIN PLUG
A371-type Analog Uncooled Isolated DFB FastLight Laser module A371型模拟制冷隔离足协FastLight⑩激光模

File Size 163.79K  /  8 Page

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    D3SB60 D3SB100 D3SB20 D3SB40 D3SB80

SeCoS Halbleitertechnologie GmbH
SeCoS Halbleitertechnol...
Part No. D3SB60 D3SB100 D3SB20 D3SB40 D3SB80
Description molding Single-Phase Bridge Rectifier

File Size 476.50K  /  2 Page

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    ST333R4F1

KODENSHI KOREA CORP.
Part No. ST333R4F1
Description Visible ray cutting resin molding

File Size 138.42K  /  3 Page

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