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Amphenol Communications Solutions |
| Part No. |
131-3316-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69133-168HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69133-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3316-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69133-164HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10118744-3133169LF
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| Description |
C - Commercial Series; Mezzanine Receptacle, SMT; 1mm Pitch; 69p
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3316-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69133-166HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3316-21H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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IDEC, Corp.
AVAGO TECHNOLOGIES LIMI...
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| Part No. |
HSMP-381Z-BLKG
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| Description |
100 V, SILICON, PIN DIODE LEAD FREE PACKAGE-2
Low Distortion Attenuator RF PIN Diodes In Surface Mount SOD-323 Package
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| File Size |
103.19K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
69133-160HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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