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  die-28 Datasheet PDF File

For die-28 Found Datasheets File :: 18891    Search Time::1.75ms    
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    美国讯泰微波有限公司上海代表
Part No. HMC486
OCR Text ...from 7 to 9 ghz. this ampli er die provides 26 db of gain, +34 dbm of saturated power and 24% pae from a +7.0 v supply voltage. output ip...28 29 30 31 32 33 34 35 36 6 6.5 7 7.5 8 8.5 9 9.5 10 +25c +85c -55c psat (dbm) frequency (ghz) 26 ...
Description GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 7.0 - 9.0 GHz

File Size 359.04K  /  8 Page

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    Transcom
Part No. TC1101
OCR Text ...: 886-6-5051602 8 chip handling die attachment: conductive epoxy or eutectic die attach is recommended. eutectic die attach can be accomplished with au-sn (80%au-20%sn) perform at stage temperature: 290 c 5 c; handling tool: tweezers;...
Description Low Noise and Medium Power GaAs FETs

File Size 152.35K  /  6 Page

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    KRTBHDLP71.32

OSRAM GmbH
Part No. KRTBHDLP71.32
OCR Text ...-videow?nden entwickelt worden. die 4-lead common anode technologie l??t eine unah?ngige ansteuerung aller chips zu und bietet dadurch ei...28 luminous intensity 1) page 28 i f = 10 ma (red), 5 ma (true green), 5 ma (blue) i v (mcd) red t...
Description DISPLIX E2020

File Size 665.00K  /  28 Page

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    ADMV7810CHIPS

Analog Devices
Part No. ADMV7810CHIPS
OCR Text ... no external matching required die size: 2.999 mm 3.799 mm 0.05 mm applications e-band communication systems high capacity wireless b...28 dbm of output power at 1 db compression, and 29 dbm of saturated output power at 18% power added...
Description Amplifier with Power Detector

File Size 307.10K  /  17 Page

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    MP3V5004GVP MP3V5004DP MP3V5004G MP3V5004GC6T1 MP3V5004GC6U MP3V5004GC7U MP3V5004GP

Freescale Semiconductor, Inc
Part No. MP3V5004GVP MP3V5004DP MP3V5004G MP3V5004GC6T1 MP3V5004GC6U MP3V5004GC7U MP3V5004GP
OCR Text ...fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the...28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIF...
Description Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

File Size 270.62K  /  14 Page

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    Infineon Technologies A...
INFINEON[Infineon Technologies AG]
Part No. SIGC25T60UN Q67041-A4667-A001 SGP30N60HS
OCR Text ...T60UN VCE 600V ICn 30A Die Size 4.5 x 5.71 mm2 Package sawn on foil Ordering Code Q67041-A4667A001 MECHANICAL PARAMETER: R...28.11.2003 SIGC25T60UN MAXIMUM RATINGS: Parameter Collector-emitter voltage, Tj=25 C DC collecto...
Description HIGHT SPEED IGBT CHIP IN NPT-TECHNOLOGY

File Size 66.48K  /  4 Page

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    CGB7005-BD-000V

Mimix Broadband
Part No. CGB7005-BD-000V
OCR Text ...r Testing ESD Protection on All Die: >1000V HBM Low Thermal Resistance: <85C/Watt Chip Layout Absolute Maximum Ratings Max Device Vol...28.5 4.0 4.3 67 73 59 54 14 13 13.5 12.5 18.2 18.2 17.2 17.2 30.5 30.5 3.2 3.2 63 63 18 18 ...
Description DC-6.0 GHz InGaP HBT MMIC Matched Gain Block Amplifier

File Size 399.82K  /  7 Page

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    CGB7006-BD-000V CGB7006-BD

MIMIX[Mimix Broadband]
Part No. CGB7006-BD-000V CGB7006-BD
OCR Text ...r Testing ESD Protection on All Die: >1000V HBM Low Thermal Resistance: <85C/Watt Chip Layout Absolute Maximum Ratings Description Th...28.5 5.0 5.3 68 71 60 57 13 12 11.0 10.5 14.2 14.2 16.8 16.8 30.5 30.5 4.2 4.2 64 64 17 17 ...
Description DC-6.0 GHz InGaP HBT MMIC Matched Gain Block Amplifier

File Size 424.11K  /  7 Page

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For die-28 Found Datasheets File :: 18891    Search Time::1.75ms    
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