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For binding Found Datasheets File :: 4093 Search Time::1.422ms
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				Philips Semiconductors
Part No.	TDA7021T
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal ...
Description	FM radio circuit for MTS
File Size	137.29K / 13 Page	View it Online	Download Datasheet

				Philips
Part No.	TDA7088T
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal ...
Description	FM receiver circuit for battery
File Size	94.05K / 16 Page	View it Online	Download Datasheet

				Advanced Power Technology
Part No.	APT40GT60BR
OCR Text	...ting Torque using a 6-32 or 3mm binding Head Machine Screw MIN TYP MAX UNIT C/W lb*in 0.36 40 10 Repetitive Rating: Pulse width limited by maximum junction temperature. IC = IC2, VCC = 50V, RGE = 25, L = 200H, Tj = 25C See...
Description	The Thunderbolt IGBT⑩ is a new generation of high voltage power IGBTs.
File Size	20.09K / 2 Page	View it Online	Download Datasheet

				HAMAMATSU[Hamamatsu Corporation]
Part No.	C7169
OCR Text	...o 240 50/60 +5 to +50 -20 to+50 binding post 147 x 61 x 200 Approx.1.2 Unit V A V V Hz C C -- mm kg Amplifier Units These are amplifier units for photomultiplier tubes and current output type PMT modules. C7319: Switchable between 2 ...
Description	Power Supply for PMT Modules
File Size	280.85K / 4 Page	View it Online	Download Datasheet

				Motorola, Inc
Part No.	MC68HC705L28 MC68HC705L28B MC68HC05L28 MC68HC05L28B
OCR Text	...ble of contents Index Page size/binding Overall impression Poor t t t t t t t t t t t t t t t t t t t t t t t Not at all t t t t t t t t t t t t t t t t t t t t 2. What is your intended use for this document? ...
Description	HCMOD Microcontroller Unit Flexible general-purpose microcomputer
File Size	533.38K / 156 Page	View it Online	Download Datasheet

				Philips
Part No.	74HC7014
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 74HC7014 Several techniques exist for reflowing; for ex...
Description	Hex non-inverting precision
File Size	51.56K / 9 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors N.V.
Part No.	74HC1G00 74HCT1G00 74HC1G00GW 74HC1G00GV 74HCT1G00GV 74HCT1G00GW
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection ...
Description	74HC1G00; 74HCT1G00; 2-input NAND gate 2-input NAND gate 2输入与非
File Size	68.50K / 16 Page	View it Online	Download Datasheet

				Philips
Part No.	74HC1G86 74HC1G86GV 74HCT1G86 74HCT1G86GV
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection ...
Description	74HC1G86; 74HCT1G86; 2-input EXCLUSIVE_OR gate 2-input EXCLUSIVE-OR gate
File Size	68.86K / 16 Page	View it Online	Download Datasheet

				Philips
Part No.	CGY2105ATS
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection ...
Description	High dynamic range dual LNA
File Size	87.46K / 16 Page	View it Online	Download Datasheet

For binding Found Datasheets File :: 4093 Search Time::1.422ms
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