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  79107-7054 Datasheet PDF File

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    70545-0019

Molex Electronics Ltd.
Part No. 70545-0019
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 20 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 20 Circuits, Tin (Sn) Plating

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Amphenol Communications Solutions

Part No. 10128479-107500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 13 Column, 104 Position, 7.50mm Stack Height, 2.00mm (0.079in) Column Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70545-0021

Molex Electronics Ltd.
Part No. 70545-0021
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 22 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 22 Circuits, Tin (Sn) Plating

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Amphenol Communications Solutions

Part No. 10136647-054232LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Black Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

    70545-0018

Molex Electronics Ltd.
Part No. 70545-0018
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 19 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 19 Circuits, Tin (Sn) Plating

File Size 252.51K  /  5 Page

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Amphenol Communications Solutions

Part No. 10136647-054132LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

    70545-0017

Molex Electronics Ltd.
Part No. 70545-0017
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 18 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 18 Circuits, Tin (Sn) Plating

File Size 252.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0014

Molex Electronics Ltd.
Part No. 70545-0014
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 15 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 15 Circuits, Tin (Sn) Plating

File Size 252.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0006

Molex Electronics Ltd.
Part No. 70545-0006
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 7 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 7 Circuits, Tin (Sn) Plating

File Size 252.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 68705-407HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70545-0004

Molex Electronics Ltd.
Part No. 70545-0004
Description 2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 5 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 5 Circuits, Tin (Sn) Plating

File Size 252.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 10124677-0542R11LF
Description DDR4 Memory Module Sockets, Storage and Server Connector, Vertical, Surface Mount, 288 Position, 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

    70543-0039

Molex Electronics Ltd.
Part No. 70543-0039
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 5Circuits, Tin (Sn) Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    P79107 P2680-02 P2680-03 P2038-02 P2038-03

Hamamatsu Corporation
Part No. P79107 P2680-02 P2680-03 P2038-02 P2038-03
Description PbSe photoconductive detector

File Size 89.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-425HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    LA7054

SANYO[Sanyo Semicon Device]
Part No. LA7054
Description Video / Audio Signal Processor for UHF Band RF Modulator
Video, Audio Signal Processor for UHF Band RF Modulator

File Size 50.31K  /  3 Page

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Amphenol Communications Solutions

Part No. 68705-420HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

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