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  51163-1300 Datasheet PDF File

For 51163-1300 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    EPC-1300-1.0-0 EPC-13.0-1.0-0

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-0 EPC-13.0-1.0-0
Description Photodiode-Chip
File Size 120.43K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. XPN1300ANC
Description N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    PDP-4R-1300 PDP-4R-50

Merrimac Industries, Inc.
Part No. PDP-4R-1300 PDP-4R-50
Description 100 MHz - 2000 MHz RF/MICROWAVE SPLITTER AND COMBINER, 3 dB INSERTION LOSS HERMATIC, 14 PIN
Analog IC 模拟IC
0 POWER DIVIDERS / COMBINERS
File Size 63.02K  /  1 Page

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Amphenol Communications Solutions
Part No. 54112-109401300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Roithner LaserTechnik G...
Part No. EPD-1300-0-3.0
Description    Photodiode
File Size 126.51K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-407061300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    F28-1300-C2

TRIAD MAGNETICS
Part No. F28-1300-C2
Description CLASS 2/3 TRANSFORMER
File Size 39.75K  /  1 Page

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Amphenol Communications Solutions
Part No. 54112-107241300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-1.0-1 EPC-1.00-1.0-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-1 EPC-1.00-1.0-1
Description Photodiode-Chip
File Size 119.99K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-112041300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    ELS-1300

MINI[Mini-Circuits]
Part No. ELS-1300
Description Electronic Line Stretcher 750 to 1300 MHz 750 MHz - 1300 MHz, 360 deg RF/MICROWAVE PHASE SHIFTER
File Size 77.04K  /  1 Page

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Amphenol Communications Solutions
Part No. 54121-112071300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPD-1300-0-0.5

EPIGAP optoelectronic GmbH
Part No. EPD-1300-0-0.5
Description Photodiode
File Size 44.47K  /  2 Page

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Amphenol Communications Solutions
Part No. 54242-106301300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-3.0-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-4
Description Photodiode-Chip
File Size 122.13K  /  2 Page

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Amphenol Communications Solutions
Part No. 69913-002
Description 1x4 PCB Header, Low Profile Right Angle, 3.81mm (0.15inch) Solder tail, Off White
Tech specs 　 　

Official Product Page

    EPC-1300-0.5-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.5-4
Description Photodiode-Chip
File Size 122.82K  /  2 Page

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Amphenol Communications Solutions
Part No. 67013-005LF
Description Berg Duflex Housing, single row, 5 Position.
Tech specs 　 　

Official Product Page

    EPC-1300-0.5-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.5-3
Description Photodiode-Chip
File Size 121.96K  /  2 Page

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Amphenol Communications Solutions
Part No. 67013-007LF
Description Berg Duflex Housing, single row, 7 Position.
Tech specs 　 　

Official Product Page

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