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  4mx8 Datasheet PDF File

For 4mx8 Found Datasheets File :: 102    Search Time::1.406ms    
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    聚兴科技股份有限公司
ATMEL CORP
Part No. AT49BV3218-90TI
OCR Text ...nc no connect 32-megabit (2mx16/4mx8) 3-volt only flash memory at49bv3218 at49bv3218t at49lv3218 at49lv3218t rev. 2452f?flash?10/02 2 at49bv/lv3218(t) 2452f?flash?10/02 note: *either pin 13 or pin 14 (tsop package) or ball b...
Description 2M X 16 FLASH 3V PROM, 90 ns, PDSO48

File Size 401.74K  /  25 Page

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    Samsung Electronic
Part No. K3N6C3000E-DC
OCR Text 4mx8) CMOS MASK ROM FEATURES * 4,194,304x8 bit organization * Fast access time 100ns(Max.) : CL=50pF 120ns(Max.) : CL=100pF * Supply voltage : single +5V * Current consumption Operating : 50mA(Max.) Standby : 50A(Max.) * Fully static oper...
Description 32M-Bit (4mx8) CMOS MASK ROM Data Sheet

File Size 45.32K  /  3 Page

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    Samsung Electronic
Part No. K3N6C1000E-GCTCYC
OCR Text 4mx8 /2Mx16) CMOS MASK ROM FEATURES * Switchable organization 4,194,304x8(byte mode) 2,097,152x16(word mode) * Fast access time 100ns(Max.) : CL=50pF 120ns(Max.) : CL=100pF * Supply voltage : single +5V * Current consumption Operating : 5...
Description 32M-Bit (4mx8 /2Mx16) CMOS MASK ROM Data Sheet

File Size 58.56K  /  4 Page

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    WEDF1M32B-905 WEDF1M32B-705 WEDF1M32B-XHX5 WEDF1M32B-1205 WEDF1M32B-XG2TX5

White Electronic Designs Corporation
Part No. WEDF1M32B-905 WEDF1M32B-705 WEDF1M32B-XHX5 WEDF1M32B-1205 WEDF1M32B-XG2TX5
OCR Text ..., user configurable as 2Mx16 or 4mx8. Commercial, Industrial and Military Temperature Ranges 5V 10% for Read and Write Operations. Low Power CMOS Embedded Erase and Program Algorithm Built-in Decoupling Caps and Multiple Ground Pins for Lo...
Description 1Mx32 5V Flash Module(5VMx32闪速存储器模块(存取时间90ns
1Mx32 5V Flash Module(5VMx32闪速存储器模块(存取时间70ns
1Mx32 5V Flash Module(5VMx32闪速存储器模块(存取时间120ns
Flash MCP 闪存MCP

File Size 192.52K  /  8 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KM23C32120C
OCR Text ...ound n.c no connection 32m-bit (4mx8) cmos mask rom the km23c32120c is a fully static mask programmable rom organized 4,194,304 x 8 bit. it is fabricated using silicon-gate cmos process technology. this device operates with a 5v single pow...
Description 32M-Bit (4mx8) CMOS Mask ROM(32M(4mx8) CMOS掩膜ROM)

File Size 58.38K  /  4 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KM23C32101C
OCR Text ...ound n.c no connection 32m-bit (4mx8) cmos mask rom the km23c32101c is a fully static mask programmable rom organized 4,194,304x8 bit. it is fabricated using silicon gate cmos process technology. this device operates with a 5v single power ...
Description 32M-Bit (4mx8) CMOS MASK ROM(32M(4mx8) CMOS掩膜ROM)

File Size 55.06K  /  4 Page

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    Samsung Electronic
Part No. K3N6VU1000E-GC/TC/YC
OCR Text 4mx8 /2Mx16) CMOS MASK ROM FEATURES * Switchable organization 4,194,304x8(byte mode) 2,097,152x16(word mode) * Fast access time 3.3V Operation : 100ns(Max.)@CL=50pF, 120ns(Max.)@CL=100pF 3.0V Operation : 120ns(Max.)@CL=100pF * Supply volt...
Description 32M-Bit (4mx8 /2Mx16) CMOS MASK ROM Data Sheet

File Size 47.14K  /  3 Page

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    Hynix Semiconductor Inc.
Hynix Semiconductor, Inc.
Part No. HY27LF081G2M-TCP HY27LF081G2M-TCS HY27LF161G2M-TCB HY27LF161G2M-TCS HY27SF081G2M-TCP HY27SF081G2M-TCB HY27LF081G2M-TCB HY27LF161G2M-TCP HY27SF081G2M-F HY27UF081G2M-F HY27SF161G2M-FP HY27UF161G2M-FP HY27SF081G2M-V HY27UF081G2M-V HY27SF161G2M-VP HY27UF161G2M-VP HY27LF081G2M-VCB HY27LF081G2M-VCP HY27LF081G2M-VCS HY27LF081G2M-VEP HY27LF081G2M-VES HY27LF081G2M-TMB HY27LF081G2M-TMP HY27LF081G2M-TMS HY27LF161G2M-TMB HY27LF161G2M-TMP HY27LF161G2M-TMS HY27SF081G2M-TMB HY27SF081G2M-TMP HY27SF081G2M-TMS HY27SF161G2M-TMB HY27SF161G2M-TMP HY27SF161G2M-TMS HY27UF081G2M-TMB HY27UF081G2M-TMP HY27UF081G2M-TMS HY27UF161G2M-TMB HY27UF161G2M-TMP HY27UF161G2M-TMS HY27LF081G2M-VMB HY27LF081G2M-VMP HY27LF081G2M-VMS HY27LF161G2M-VMB HY27LF161G2M-VMP HY27LF161G2M-VMS HY27SF081G2M-VMB HY27SF081G2M-VMP HY27SF161G2M-VMB HY27SF161G2M-VMP HY27SF161G2M-VMS HY27UF081G2M-VMB HY27UF081G2M-VMP HY27UF081G2M-VMS HY27UF161G2M-VMB HY27UF161G2M-VMP HY27UF161G2M-VMS HY27LF081G2M-VEB HY27SF081G2M-VMS HY27LF081G2M-TPMP HY27LF081G2M-VPMP HY27SF081G2M-TPMP HY27SF081G2M-VPMP HY27LF161G2M-TPIS HY27SF161G2M-TPIS HY27LF161G2M-TIS HY27LF161G2M-VIS HY27SF161G2M-TIS HY27SF161G2M-VIS HY27LF161G2M-VPIS HY27SF081G2M-TEP HY27SF081G2M-TP
OCR Text ...eries is a 128Mx8bit with spare 4mx8 bit capacity. The device is offered in 1.8V Vcc Power Supply and in 3.3V Vcc Power Supply. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. The memory is d...
Description Inductor; Inductor Type:Power; Inductance:2uH; Inductance Tolerance: 25 %; Series:CTX; Package/Case:PCB Surface Mount; Core Material:Amorphous Metal; Current, lt rms Parallel:7.26A; Current, lt rms Series:3.63A RoHS Compliant: Yes
3.3V Differential Transceiver 8-PDIP -40 to 85
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory 1Gbit的(128Mx8bit / 64Mx16bit)NAND闪存
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory 128M X 8 FLASH 1.8V PROM, 30 ns, PDSO48
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory 64M X 16 FLASH 1.8V PROM, 30 ns, PDSO48
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory 64M X 16 FLASH 3.3V PROM, 30 ns, PDSO48
CONNECTOR ACCESSORY 128M X 8 FLASH 3.3V PROM, 30 ns, PDSO48
CONNECTOR ACCESSORY 64M X 16 FLASH 1.8V PROM, 30 ns, PDSO48
Power Heater Soldering Tip; Tip/Nozzle Style:Chisel; Tip/Nozzle Thickness:0.2"; Tip/Nozzle Size:0.40 1Gbit的(128Mx8bit / 64Mx16bit)NAND闪存
COILTRONICS RoHS Compliant: Yes 1Gbit的(128Mx8bit / 64Mx16bit)NAND闪存
Power Heater Soldering Tip; Tip/Nozzle Style:Chisel; Tip/Nozzle Thickness:0.1"; Tip/Nozzle Size:0.43 RoHS Compliant: Yes
   1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory

File Size 484.04K  /  48 Page

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    http://
Part No. WEDF1M32B-090HM5A WEDF1M32B-HI5A WEDF1M32B-HM5 WEDF1M32B-HM5A
OCR Text ... user con? gurable as 2mx16 or 4mx8. commercial, industrial and military temperature ranges 5v 10% for read and write operations. low power cmos embedded erase and program algorithm built-in decoupling caps and multipl...
Description 1Mx32 5V Flash Module

File Size 339.32K  /  8 Page

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    HY27US081G1M HY27US161G1M

Hynix Semiconductor
Part No. HY27US081G1M HY27US161G1M
OCR Text ...eries is a 128Mx8bit with spare 4mx8 bit capacity. The device is offered in 3.3V Vcc Power Supply. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. The memory is divided into blocks that can b...
Description 1Gbit (128Mx8bit / 64Mx16bit) NAND Flash

File Size 320.76K  /  39 Page

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For 4mx8 Found Datasheets File :: 102    Search Time::1.406ms    
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