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wire-bond Datasheet PDF File

For wire-bond Found Datasheets File :: 3408 Search Time::1.406ms
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				NEC[NEC]
Part No.	UPG110P
OCR Text	...ot recommended. Bonding Machine Wire Strength Atmosphere : TCB * USB is not recommended : 30 m diameter Au wire : 31 3 g : N2 gas Temperatu...Bond Pull Tests (In case of recommended chip handling) MIL-STD-883 Method 2011 5 samples/wafer and 2...
Description	2 to 8 GHz WIDE BAND AMPLIFIER CHIP
File Size	49.14K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Produc... MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products] Maxim Integrated Products, Inc.
Part No.	32TSOP
OCR Text	...e: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Theta JA: Theta JC: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: PACKAGE TESTS DESCRIPTION SOLDERABILITY DATE CODE CONDITION 0429 JESD22-B102 Total: READPOINT QTY FAILS ...
Description	PACKAGE RELIABILITY REPORT
File Size	32.75K / 11 Page	View it Online	Download Datasheet

				http:// HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard) Avago Technologies, Ltd. PATLITE, Corp.
Part No.	HSMD-TX00 HSME-TX00 HSMG-TX00 HSMH-TX00 HSMS-TX00 HSMY-TX00 HSMY-T400 HSMG-T400 HSMG-T500 HSMG-T600 HSMD-T400 HSMD-T500 HSMY-T500 HSMY-T600 HSMY-T700 HSMD-T600 HSMD-T700 HSME-T400 HSME-T500 HSME-T600 HSME-T700 HSMG-T700 HSMH-T400 HSMH-T500 HSMH-T600 HSMH-T700 HSMS-T400 HSMS-T500 HSMS-T600 HSMS-T700
OCR Text	...ithout damaging the LED die and wire bond. The device should not be operated at peak currents above the Absolute Maximum Peak Forward Current. 1-206 Electrical/Optical Characteristics at TA = 25C DH AS AlGaAs Red HSMH-TX00 Parameter ...
Description	SINGLE COLOR LED, HIGH EFFICIENCY RED, 2.2 mm 2W ISOLATED DUAL OUTPUT CONVERTER RoHS Compliant: Yes Surface Mount LED Indicator 表面贴装LED指示
File Size	196.12K / 8 Page	View it Online	Download Datasheet

				TEMIC[TEMIC Semiconductors]
Part No.	U3741BM-M2FL U3741BM-M2FLG3 U3741BM-M3FL U3741BM-M3FLG3 U3741BM
OCR Text	...(see figures 5 and 6), the bond wire inductivity of the LNA ground is compensated. C3 forms a series resonance circuit together with the bond wire. L = 25 nH is a feed inductor to establish a DC path. Its value is not critical but must be l...
Description	UHF ASK/FSK Receiver
File Size	417.50K / 25 Page	View it Online	Download Datasheet

				ATMEL[ATMEL Corporation] Advanced Analogic Technologies
Part No.	U3741BM U3741BM-P2FL U3741BM-P2FLG3 U3741BM-P3FL U3741BM-P3FLG3
OCR Text	...igure 3 and Figure 4), the bond wire inductivity of the LNA ground is compensated. C3 forms a series resonance circuit together with the bond wire. L = 25 nH is a feed inductor to establish a DC path. Its value is not critical but must be l...
Description	UHF ASK RECEIVER IC
File Size	384.09K / 32 Page	View it Online	Download Datasheet

				ATMEL[ATMEL Corporation]
Part No.	U3745BM U3745BM-MFL U3745BM-MFLG3
OCR Text	...igure 3 and Figure 4), the bond wire inductivity of the LNA ground is compensated. C3 forms a series resonance circuit together with the bond wire. L = 25 nH is a feed inductor to establish a DC path. Its value is not critical but must be l...
Description	UHF ASK RECEIVER IC
File Size	395.60K / 29 Page	View it Online	Download Datasheet

For wire-bond Found Datasheets File :: 3408 Search Time::1.406ms
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