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Part No. |
IRGC3B60KB
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OCR Text |
wafer form)
nominal backmetal composition, (thickness) al - ti - ni/v - ag, (1ka - 1ka - 4ka - 6ka) nominal front metal composition, (thickness) 99% al/1% si, (4m) dimensions 0.085" x 0.090" wafer diameter 150mm, with std. < 100... |
Description |
600 V, N-CHANNEL IGBT
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File Size |
47.54K /
1 Page |
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it Online |
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Part No. |
IRGC100B120KB
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OCR Text |
wafer form mechanical data electrical characteristics (wafer form) die outline nominal backmetal composition, (thickness) al - ti - ni/v - ag, (1ka - 1ka - 4ka - 6ka) nominal front metal composition, (thickness) 99% al/1% si, (4m) dimension... |
Description |
1200 V, N-CHANNEL IGBT
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File Size |
18.09K /
1 Page |
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it Online |
Download Datasheet
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Part No. |
NJU6397AC-D
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OCR Text |
...ip package outline thin-die/wafer c-mos technology line-up table coordinates starting point:chip center unit[um] chip size:0.7x0.75mm thin-die thickness(c-d): 200 20um thin-die thickness(c... |
Description |
90 MHz, OTHER CLOCK GENERATOR, UUC6
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File Size |
75.97K /
5 Page |
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it Online |
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Part No. |
IRGC49B120UB
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OCR Text |
wafer form mechanical data electrical characteristics (wafer form) die outline nominal backmetal composition, (thickness) al - ti - ni/v - ag, (1ka - 1ka - 4ka - 6ka) nominal front metal composition, (thickness) 99% al/1% si, (4m) dimension... |
Description |
1200 V, N-CHANNEL IGBT TRANSISTOR | IGBT | N-CHAN | 1.2KV V(BR)CES | CHIP
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File Size |
15.03K /
1 Page |
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it Online |
Download Datasheet
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Price and Availability
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