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S1WBA60B 5N200 1H220 P6KE1 1H220 4LS37 SCS421D 62107P
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For substrates Found Datasheets File :: 1677    Search Time::2ms    
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    M/A-COM Technology Solu...
Part No. MADS-002545-1307HG
OCR Text ...ure solder attachment onto hard substrates. 80au/20sn and sn63/pb36 solders are acceptable for usage. for hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly ...
Description Ultra Low Parasitic Capacitance and Inductance

File Size 585.64K  /  4 Page

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    HMC258

Hittite Microwave Corpo...
Hittite Microwave Corporation
Part No. HMC258
OCR Text ...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description    GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 14 - 21 GHz
GaAs MMIC SUB-HARMONICALLY PUMPED MIXER/ 14 - 21 GHz

File Size 198.60K  /  6 Page

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    HMC259

美国讯泰微波有限公司上海代表
Hittite Microwave Corporation
Part No. HMC259
OCR Text ...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 28 - 40 GHz

File Size 164.56K  /  6 Page

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    HMC281

Hittite Microwave Corporation
Part No. HMC281
OCR Text ...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description GaAs MMIC LOW NOISE AMPLIFIER 18 - 32 GHz

File Size 103.55K  /  6 Page

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    HMC459

美国讯泰微波有限公司上海代表
HITTITE[Hittite Microwave Corporation]
Part No. HMC459
OCR Text ...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description 800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18.0 GHz

File Size 254.67K  /  8 Page

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    M/A-COM Technology Solu...
Part No. MADS-002545-1307 MADS-002545-1307MG
OCR Text ...ure solder attachment onto hard substrates. 80au/20sn and sn63/p b36 solders are acceptable for usage. absolute maximum ratings @ 25 c 1 1. operation of this device abov e any one of these parameters may cause permanent damage. d...
Description SURMOUNTTM Schottky Diodes
SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip

File Size 56.34K  /  3 Page

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    NLV14007UBDR2G

ON Semiconductor
Part No. NLV14007UBDR2G
OCR Text ...a = c, b = open a = b, c = open substrates of p?channel devices internally connected to v dd ; substrates of n?channel devices internally connected to v ss . figure 2. schematic 14 13 2 1 11 12 6 78 3 4 510 9 v dd = pin 14 v ss = pin 7 ...
Description Dual Complementary Pair Plus Inverter

File Size 107.86K  /  7 Page

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    HMC814 HMC81409

Hittite Microwave Corporation
Part No. HMC814 HMC81409
OCR Text ...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 13 - 24.6 GHz OUTPUT

File Size 240.89K  /  6 Page

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    HMC-APH403

Hittite Microwave Corporation
Part No. HMC-APH403
OCR Text ...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description GaAs HEMT MMIC POWER AMPLIFIER
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 37 - 45 GHz

File Size 216.57K  /  6 Page

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    HMC-APH460

Hittite Microwave Corporation
Part No. HMC-APH460
OCR Text ...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description GaAs HEMT MMIC POWER AMPLIFIER
GaAs HEMT MMIC 0.5 WATT POWER AMPLIFIER, 27 - 31.5 GHz

File Size 224.01K  /  6 Page

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