stencil pdf Datasheet P6 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : MO63D PAA110PL CX20524 1000VDC LF205RW MMBZ5254 D1416 4LS86P
	Product Description
	Full Text Search

stencil Datasheet PDF File

For stencil Found Datasheets File :: 1989 Search Time::2.438ms
Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				ONSEMI[ON Semiconductor]
Part No.	NTD4302 NTD4302T4 NTD4302-1
OCR Text	...CALE 3:1 mm inches SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are t...
Description	Power MOSFET 68 Amps / 30 Volts(N-Channel DPAK) Power MOSFET 68 Amps, 30 Volts(N−Channel DPAK) Power MOSFET 68 Amps, 30 Volts(N-Channel DPAK)
File Size	85.76K / 10 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc] ONSEMI[ON Semiconductor] MOTOROLA[Motorola Inc]
Part No.	PZT2222AT1 PZT2222AT1_D ON2778 PZT2222AT1D PZT2222AT1G PZT2222AT3 PZT2222AT3G PZT2222AT1/D
OCR Text	...vice Data PZT2222AT1 SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ...
Description	SOT-223 PACKAGE NPN SILICON TRANSISTOR SURFACE MOUNT 600 mA, 40 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-261AA From old datasheet system
File Size	136.30K / 6 Page	View it Online	Download Datasheet

				Motorola, Inc. ON Semiconductor MOTOROLA[Motorola, Inc]
Part No.	BSP52T1 ON0221
OCR Text	...tprint. 3 BSP52T1 SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ...
Description	From old datasheet system MEDIUM POWER NPN SILICON DARLINGTON TRANSISTOR SURFACE MOUNT
File Size	113.31K / 6 Page	View it Online	Download Datasheet

				Motorola Inc Motorola, Inc ON Semiconductor
Part No.	2SA1774 ON0108
OCR Text	... 0.5 1 3 2SA1774 SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ...
Description	PNP GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT From old datasheet system
File Size	94.83K / 6 Page	View it Online	Download Datasheet

				Motorola, Inc ON Semi
Part No.	BAW56WT1 ON0138
OCR Text	...e Data 3 BAW56WT1 SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ...
Description	Dual Switching Diode From old datasheet system CASE 419 -02 ,STYLE4 SC-70SOT-323
File Size	92.64K / 6 Page	View it Online	Download Datasheet

				California Micro Devices
Part No.	CSPESD303 CSPESD302 CSPESD301
OCR Text	...tion Solder Mask Opening Solder stencil Thickness Solder stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum ...
Description	"1, 2 and 3-channel ESD Arrays in Chip Scale Package "
File Size	157.09K / 6 Page	View it Online	Download Datasheet

				意法半导 STMICROELECTRONICS[STMicroelectronics] ST Microelectronics
Part No.	EMIF06-10006F1 EMIF06-10006
OCR Text	... 545 400 545 Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 300m copper pad diameter xxx yww 100 230 All dimensions in m 5/6 EMIF06-10006F1 FLIP-CHIP TAPE AND REEL SPECIFICA...
Description	±15kV ESD Protected, 3.3V, Full Fail-safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers; Temperature Range: -40°C to 85°C; Package: 8-SOIC T&R 6 LINES EMI FILTER AND ESD PROTECTION 6 LINES EMI FILTER AND ESD PROTECTION
File Size	234.25K / 6 Page	View it Online	Download Datasheet

				ST Microelectronics ETC
Part No.	EMIF06 EMIF06-10006
OCR Text	... 545 400 545 Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 300m copper pad diameter xxx yww 100 230 All dimensions in m 5/6 EMIF06-10006F1 FLIP-CHIP TAPE AND REEL SPECIFICA...
Description	6 LINES EMI FILTER AND ESD PROTECTION
File Size	212.78K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC442LM1
OCR Text	...plied to the PCB using either a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical performance. Excess solder may ...
Description	GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 17.5 - 24 GHz
File Size	309.72K / 8 Page	View it Online	Download Datasheet

				CALMIRCO[California Micro Devices Corp]
Part No.	PACDN1408CR PACDN1404CR PACDN1404C PACDN1404 PACDN1416CR PACDN1416C PACDN1408C
OCR Text	...tion Solder Mask Opening Solder stencil Thickness Solder stencil Aperture Opening Solder Flux Ratio Solder Paste Bond Trace Finish 0.300mm Round Non Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq.) 50/50 No Clean OSP (Entek Cu ...
Description	ESD PROTECTION ARRAYS CHIP SCALE PACKAGE ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE ESD PROTECTION ARRAYS/ CHIP SCALE PACKAGE
File Size	49.48K / 3 Page	View it Online	Download Datasheet

For stencil Found Datasheets File :: 1989 Search Time::2.438ms
Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |